Slurry Injection Schemes on the Extent of Slurry Mixing and Availability during Chemical Mechanical Planarization [PDF]
Micromachines, 2017 In this study, slurry availability and the extent of the slurry mixing (i.e., among fresh slurry, spent slurry, and residual rinse-water) were varied via three different injection schemes.
Matthew Bahr +3 more
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Monodisperse SiO2 Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing [PDF]
NanomaterialsThe atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface.
Jinlong Ge +7 more
doaj +2 more sources
Colloid Aspects of Chemical-Mechanical Planarization
Kemija u Industriji, 2010 The essential parts of interconnects for silicon based logic and memory devices consist of metal wiring (e.g. copper), a barrier metal (Ta, TaN), and of insulation (SiO2 , low-k polymer).
Matijević, E., Babu, S. E.
doaj +1 more source
Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding [PDF]
Advanced ScienceHybrid bonding, referring to direct bonding between metal and insulator layers, has become a key technology for next‐generation semiconductor packaging, enabling high‐density interconnects, fast signal transmission, and a compact form factor.
Sukkyung Kang +5 more
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Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles.
Seonghyun Park, Hyunseop Lee
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Chemical–Mechanical Polishing of 4H Silicon Carbide Wafers
Advanced Materials Interfaces, 2023 4H silicon carbide (4H‐SiC) holds great promise for high‐power and high‐frequency electronics, in which high‐quality 4H‐SiC wafers with both global and local planarization are cornerstones.
Wantang Wang +6 more
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Correlation between pattern density and linewidth variation in silicon photonics waveguides [PDF]
, 2020 We describe the correlation between the measured width of silicon waveguides fabricated with 193 nm lithography and the local pattern density of the mask layout.
Bogaerts, Wim +3 more
core +1 more source
Applied Sciences, 2021 In the fabrication of semiconductors, chemical mechanical polishing (CMP) is an essential wafer-planarization process. For optimal CMP, it is crucial to monitor the texture of the polishing pad; this leads to homogenous planarization of wafers. Hence, we
Eun-Soo Kim, Woo-June Choi
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Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process
Applied Sciences, 2023 The effect of the two-way injection method during a copper chemical mechanical planarization (CMP) process was investigated. The two-way slurry-injection method has the advantage of not only preventing the degradation of the slurry, but also shortening ...
Chulwoo Bae +4 more
doaj +1 more source
Demonstration of silicon-on-insulator mid-infrared spectrometers operating at 3.8µm [PDF]
, 2013 The design and characterization of silicon-on-insulator mid- infrared spectrometers operating at 3.8µm is reported. The devices are fabricated on 200mm SOI wafers in a CMOS pilot line.
Chen, Xia +8 more
core +4 more sources