Results 31 to 40 of about 6,682 (189)
International Journal of Prognostics and Health Management, 2017 As an essential process in semiconductor manufacturing, Chemical Mechanical Planarization has been studied in recent decades and the material removal rate has been proved to be a critical performance indicator.
Yuan Di, Xiaodong Jia, Jay Lee
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Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System
Applied Sciences, 2020 This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure
Chao-Chang A. Chen +4 more
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KONA Powder and Particle Journal, 2023 Chemical mechanical polishing (CMP) is a process that uses mechanical abrasive particles and chemical interaction in slurry to remove materials from the surface of films. With advancements in semiconductor device technology applying various materials and
Ganggyu Lee +4 more
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Integration of InP and InGaAs on 300 mm Si wafers using chemical mechanical planarization [PDF]
, 2016 Integration of III-V high mobility channel materials in complementary metal oxide semiconductors (CMOS) and III-V photonic materials for integrated light sources on Si substrates requires low defect density III-V buffer layers in order to enable ...
Orzali, Tommaso +4 more
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Slurry Design for Chemical Mechanical Polishing
KONA Powder and Particle Journal, 2014 Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi-layer metallization.
G. Bahar Basim, Brij M. Moudgil
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Hybrid CMP Slurry Supply System Using Ionization and Atomization
Applied Sciences, 2021 Chemical mechanical planarization (CMP) is frequently used in semiconductor manufacturing to polish the surfaces of multiple layers in a wafer. The CMP uses a slurry that aids in fabricating a smooth surface by removing the excess materials.
Hoseong Jo +4 more
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Double-walled carbon nanotube-based polymer composites for electromagnetic protection. [PDF]
, 2010 In this paper, we present a microwave absorber based on carbon nanotubes (CNT) dispersed inside a BenzoCycloButenw (BCB) polymer. The high aspect ratio and remarkable conductive characteristics of CNT give rise to good absorbing properties for ...
Bianco +10 more
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Copper removal from semiconductor CMP wastewater in the presence of nano-SiO2 through biosorption
Water Reuse, 2021 Copper-bearing wastewater from chemical mechanical planarization (CMP) is a typical semiconductor development byproduct. How to effectively treat Cu2+ in the CMP wastewater is a great concern in the microchip manufacturing industry.
Xiaoyu Wang +4 more
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Packaging technology enabling flexible optical interconnections [PDF]
, 2011 This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials.
Bosman, Erwin +5 more
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Scientific Reports, 2023 Silicon carbide (SiC) wafers have attracted attention as a material for advanced power semiconductor device applications due to their high bandgap and stability at high temperatures and voltages. However, the inherent chemical and mechanical stability of
Ganggyu Lee +7 more
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