Results 41 to 50 of about 6,682 (189)
KONA Powder and Particle Journal, 2014 Chemical Mechanical Planarization (CMP) is a process that is now routinely used to planarize metal as well dielectric films during the fabrication of integrated circuits.
Srini Raghavan +2 more
doaj +1 more source
Characterization Of Thermal Stresses And Plasticity In Through-Silicon Via Structures For Three-Dimensional Integration [PDF]
, 2014 Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause ...
Ho, P. S. +4 more
core +1 more source
Applied Surface Science AdvancesChemical mechanical planarization (CMP) faces critical challenges including non-uniform material removal, surface defect generation, and complex tribochemical interactions that limit process control at advanced semiconductor nodes.
Seokgyu Ryu +5 more
doaj +1 more source
International Journal of Electrochemical ScienceCopper electrochemical mechanical polishing (ECMP) is a critical planarization technique for advanced integrated circuit manufacturing, particularly as feature sizes shrink below 65 nm and low‑k dielectrics—vulnerable to mechanical damage—are ...
Yan-Fei Bian +3 more
doaj +1 more source
Single-charge devices with ultrasmall Nb/AlOx/Nb trilayer Josephson junctions
, 2004 Josephson junction transistors and 50-junction arrays with linear junction dimensions from 200 nm down to 70 nm were fabricated from standard Nb/AlOx/Nb trilayers.
A. B. Zorin +4 more
core +1 more source
Co-integration of Ge detectors and Si modulators in an advanced Si photonics platform [PDF]
, 2012 A Si photonics platform is described, co-integrating advanced passive components with Si modulators and Ge detectors. This platform is developed on a 200mm CMOS toolset, compatible with a 130nm CMOS baseline.
Absil, Philippe +8 more
core +1 more source
An ohmic RF MEMS switch for reconfigurable microstrip array antennas built on PCB [PDF]
, 2008 This paper presents the analysis, design and simulation of an ohmic RF MEMS switch specified for reconfigurable microstrip array antennas built on PCB via an integrated monolithic technology.
Charalampidis, N +6 more
core
Spectroscopic ellipsometry on thin titanium oxide layers grown on titanium by plasma oxidation [PDF]
, 2011 : Electronic devices based on tunnel junctions require tools able to accurately control the thickness of thin metal and oxide layers on the order of the nanometer.
Beaumont, A. +3 more
core +2 more sources
LubricantsChemical–mechanical planarization (CMP) is used to smoothen the topographies of a rough surface by combining several functions of tribology (friction, lubrication), chemistry, and electrochemistry (corrosion, wear, tribo-corrosion).
Kassapa Gamagedara, Dipankar Roy
doaj +1 more source
On the design of an Ohmic RF MEMS switch for reconfigurable microstrip antenna applications [PDF]
, 2009 This paper presents the analysis, design and simulation of a direct contact (dc) RF MEMS switch specified for reconfigurable microstrip array antennas.
D. Kampitaki +7 more
core +2 more sources