Results 51 to 60 of about 6,682 (189)
Electrically-pumped, broad-area, single-mode photonic crystal lasers [PDF]
, 2007 Planar broad-area single-mode lasers, with modal widths of the order of tens of microns, are technologically important for high-power applications and improved coupling efficiency into optical fibers.
Chak, Philip +5 more
core +1 more source
Advances in Materials Science and Engineering, 2014 Chemical mechanical polishing (CMP) technology is extensively used in the global planarization of highly value-added and large components in the aerospace industry. A nanopowder of SiO2 was prepared by the sol-gel method and was compounded into polishing
M. J. Kao, F. C. Hsu, D. X. Peng
doaj +1 more source
Scalable methods for ultra-smooth platinum in nanoscale devices
Micro and Nano Engineering, 2019 Ultra-smooth metal structures are increasingly important in nanoscale device applications, from photonics to molecular electronics and 2D material growth.
Charmaine Chia +2 more
doaj +1 more source
Machines, 2022 Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao +4 more
doaj +1 more source
Ultrathin TaN Damascene Nanowire Structures on 300-mm Si Wafers for Quantum Applications
IEEE Transactions on Quantum Engineering, 2023 We report on the development and characterization of superconducting damascene tantalum nitride (TaN) nanowires, 100 nm–3 μm wide, with TaN thicknesses varying from 5 to 35 nm, using 193-nm optical lithography and chemical mechanical ...
Ekta Bhatia +19 more
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Role of the Oxidation State in Cobalt Chemical Mechanical Planarization
MetalMatCobalt (Co) is a promising next‐generation contact metal to replace tungsten for the system‐large‐scale integration devices beyond the 5 nm technology node due to its low resistivity and high gap‐filling capability at high aspect ratios.
Ganggyu Lee +7 more
doaj +1 more source
Research of Vertical via Based on Silicon, Ceramic and Glass
Micromachines, 2023 With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial.
Wenchao Tian, Sixian Wu, Wenhua Li
doaj +1 more source
Process development of silicon-silicon carbide hybrid structures for micro-engines (January 2002) [PDF]
, 2002 MEMS-based gas turbine engines are currently under development at MIT for use as a button-sized portable power generator or micro-aircraft propulsion sources. Power densities expected for the micro-engines require very high rotor peripheral speeds of 300-
Choi, D. +2 more
core
Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures [PDF]
, 2004 Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS).
Boning, Duane S., Tang, Brian D.
core
, 2011 We use ultra-high vacuum chemical vapor deposition to grow polycrystalline silicon carbide (SiC) on c-plane sapphire wafers which are then annealed between 1250 and 1450{\deg}C in vacuum to create epitaxial multilayer graphene (MLG).
Breslin, Christopher M. +8 more
core +1 more source