Vertical liquid controlled adiabatic waveguide coupler [PDF]
, 2018 A broadband vertical liquid controlled optical waveguide coupler (LCC) is demonstrated. The fabricated vertical LCC with silicon nitride (SiN) waveguides can switch light between 2 stacked photonic circuit layers with zero energy consumption in a steady ...
Arce, Cristina Lerma +5 more
core +2 more sources
Electrochemical Nanomachining based on Redox Hydrogel Nanofilm: Copper Planarization with nano-precision [PDF]
, 2013 纳米加工要求能够在纳米或分子、原子水平上可控地实现材料的去除、形变或增添。材料去除是目前最常用的加工手段，其特征是将材料表面的一部分与本体之间的化学或金属键打开，并将之移离。按开键原理，相关的加工可大致分为机械、能量束（离子、激光、电子等）、电化学和化学等方法，并有着各自的优缺点，如：机械和能量束法加工精度高，但会造成加工面的损伤，电化学和化学方法则相反。 近年来，飞速发展的各应用领域对加工后的表面质量要求急剧提高，特别是超大规模集成电路制造中的铜互连导线以及高能激光应用中的发/反射镜面 ...
张红万
core
Fabrication and characterization of on-chip silicon nitride microdisk integrated with colloidal quantum dots [PDF]
, 2015 International ...
Aubert, Tangi +5 more
core +2 more sources
Fully embedded optical and electrical interconnections in flexible foils [PDF]
, 2009 This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 μ m) VCSEL's and
Bosman, Erwin +4 more
core
Intimate Monolithic integration of Chip-scale Photonic Circuits [PDF]
, 2005 Cataloged from PDF version of article.In this paper, we introduce a robust monolithic integration technique for fabricating photonic integrated circuits comprising optoelectronic devices (e.g., surface-illuminated photodetectors, waveguide quantum-well ...
David A. B. Miller +10 more
core +1 more source
Nanoparticle Engineering for Chemical-Mechanical Planarization [PDF]
, 2009 Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow ...
Paik, Ungyu, Park, Jea-Gun
openaire +3 more sources
A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing [PDF]
, 2005 The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as
Chun, Jung-Hoon +2 more
core +1 more source
ElectrochemThe manufacturing of integrated circuits involves multiple steps of chemical mechanical planarization (CMP) involving different materials. Mitigating CMP-induced defects is a main requirement of all CMP schemes.
Kassapa U. Gamagedara, Dipankar Roy
doaj +1 more source
Interaction Effects of Slurry Chemistry on Chemical Mechanical Planarization of Electroplated Copper [PDF]
, 2004 Recent studies have been conducted investigating the effects of slurry chemistry on the copper CMP process. Slurry pH and hydrogen peroxide concentration are two important variables that must be carefully formulated in order to achieve desired removal ...
Imonigie, Jerome A. +2 more
core +1 more source
Mechanical Analysis on Uniformity in Copper Chemical Mechanical Planarization [PDF]
Journal of the Korean Institute of Electrical and Electronic Material Engineers, 2007 Most studies on copper Chemical Mechanical Planarization (CMP) have focused on material removal and its mechanisms. Although many studies have been conducted on the mechanism of Cu CMP, a study on uniformity in Cu CMP is still unknown. Since the aim of CMP is global and local planarization, the approach to various factors related to uniformity in Cu ...
openaire +1 more source