Intramolecular (Electron) Delocalization Between Aromatic Donors and their Tethered Cation–Radicals. Application of Electrochemical and Structural Probes [PDF]
, 2001 To study the mechanism of electronic transduction along (poly)phenylene chains, a series of aromatic donors with general formula D–B–D has been synthesized [where D = 2,5-dimethoxy-4-methylphenyl donor and B = (poly)phenylene bridge]; and the ...
Kochi, Jay K. +3 more
core +1 more source
Noncontact electrical metrology of Cu/low-k interconnect for semiconductor production wafers
, 2011 We have demonstrated a technique capable of in-line measurement of dielectric constant of low-k interconnect films on patterned wafers utilizing a test key of ~50x50 \mu m in size. The test key consists of a low-k film backed by a Cu grid with >50% metal
Andrew R. Schwartz +5 more
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A Miniature Resonant and Torsional Magnetometer Based on Lorentz Force
Micromachines, 2018 A microelectromechanical system (MEMS) torsional resonant magnetometer based on Lorentz force was investigated, consisting of torsional structures, torsional beams, metal plates, a coil, and a glass substrate.
Lingqi Wu +3 more
doaj +1 more source
Coupling Supramolecular Assemblies and Reactive Oxygen Species (ROS) with Megasonic Action for Applications in Shallow Trench Isolation (STI) Post-Chemical Mechanical Planarization (p-CMP) Cleaning. [PDF]
ACS Omega, 2022 Wortman-Otto KM +3 more
europepmc +1 more source
Side-wall metallization process for enhanced electrical contact in SOI-based MEMS switches
Micro and Nano EngineeringMEMS inertial switches provide a zero-power alternative to conventional accelerometers by mechanically closing an electrical contact only when a specific acceleration threshold is exceeded.
Inês S. Garcia +9 more
doaj +1 more source
A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing [PDF]
, 2003 The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron feature size, the ...
Chun, Jung-Hoon +2 more
core
Mechanics Framework of Pad Scratching in Chemical-Mechanical Planarization
, 2020 Chemical-Mechanical Planarization (CMP) is a crucial intermediate process in integrated circuit (IC) fabrication. As the average IC feature size decreases each year, scratches produced on wafers from polishing pads during CMP have become a prominent issue. These scratches can be much larger than features on the circuits, which results in an increase of
openaire +2 more sources
Yield improvement of chemical mechanical planarization processes
, 2018 Chemical mechanical polishing (CMP) is a planarization process that produces high quality surfaces both locally and globally. It is one of the key process steps during fabrication of very large scale integrated (VLSI) chips in integrated circuit (IC) manufacturing.
openaire +3 more sources
The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4'-Oxydianiline to Remarkably Enhance the Chemical-Mechanical Planarization Polishing Rate. [PDF]
Nanomaterials (Basel)Han MH +10 more
europepmc +1 more source
Tribo-Electrochemical Mechanism of Material Removal Examined for Chemical Mechanical Planarization of Stainless-Steel Using Citrate Buffer as a Complexing Agent. [PDF]
Materials (Basel)Santefort DR, Gamagedara KU, Roy D.
europepmc +1 more source