Results 91 to 100 of about 2,760 (214)

Scalable methods for ultra-smooth platinum in nanoscale devices

Micro and Nano Engineering, 2019
Ultra-smooth metal structures are increasingly important in nanoscale device applications, from photonics to molecular electronics and 2D material growth.
Charmaine Chia, Stefanie S. Jeffrey, Roger T. Howe   +2 more
doaj   +1 more source

Tribo-Electrochemical Characterization of Brush-Scrubbed Post-CMP Cleaning: Results for Tartrate-Supported Removal of Residual Oxides from Copper Films

Lubricants
Wafer cleaning after chemical mechanical planarization (CMP) is a critical processing step for copper metallization in integrated circuits. Post-CMP cleaning (PCMPC) commonly combines surface (electro)chemistry with the tribology of brush scrubbing to ...
Collin M. Reff, Kassapa U. Gamagedara, David R. Santefort, Dipankar Roy   +3 more
doaj   +1 more source

Particulate Science and Technology in the Engineering of Slurries for Chemical Mechanical Planarization

KONA Powder and Particle Journal, 2014
Chemical Mechanical Planarization (CMP) is a process that is now routinely used to planarize metal as well dielectric films during the fabrication of integrated circuits.
Srini Raghavan, Manish Keswani, Renhe Jia   +2 more
doaj   +1 more source

Chemical Machining Technology [PDF]

, 2015
Tato bakalářská práce popisuje nejpoužívanější metody chemického obrábění v průmyslu. Jsou zde rozepsány principy jednotlivých metod, jejich výhody, nevýhody a vhodnost použití. Dále jsou zde uvedeny vlastnosti používaných chemikálií a bezpečnost práce s
Macháček, David
core  

Noncontact electrical metrology of Cu/low-k interconnect for semiconductor production wafers

, 2011
We have demonstrated a technique capable of in-line measurement of dielectric constant of low-k interconnect films on patterned wafers utilizing a test key of ~50x50 \mu m in size. The test key consists of a low-k film backed by a Cu grid with >50% metal
Andrew R. Schwartz, André Scherz, Anlage S. M., Braun A., Diebold A., Vladimir V. Talanov   +5 more
core   +1 more source

Scratching by pad asperities in chemical mechanical polishing [PDF]

, 2011
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p.
Roberts, Michael P. (Michael Philip)
core  

Predicting the Material Removal Rate in Chemical Mechanical Planarization Based on Improved Neural Network

IEEE Access
Chemical Mechanical Planarization (CMP) technology in integrated circuit manufacturing plays a critical role in realizing local and global flatness of silicon wafer surface.
Jianchao Wang, Zhaoyang Shi, Pingping Yu, Zhenzhou Wang   +3 more
doaj   +1 more source

Abrasive-free chemical-mechanical planarization (CMP) of gold for thin film nano-patterning

Nanoscale
This 5 × 3 mm2 photograph shows the vibrant colors reflected by a nanostructured gold surface made by CMP. Each 20 × 20 μm2 pixel is a mosaic of gold nanocubes with different dimensions, creating this colorful image of the gold CMP damascene technique.
Raphael Gherman, Guillaume Beaudin, Romain Stricher, Jean-François Bryche, Pierre Levesque, François Fillion-Gourdeau, Steve G. MacLean, Dominique Drouin, Paul G. Charette, Serge Ecoffey   +9 more
openaire   +3 more sources

Novel Slurry Solutions for Thick Cu CMP [PDF]

, 2005
Electro-plating methods currently used to deposit Cu in through-wafer interconnect applications result in the formation of a thick Cu layer with large amounts of topographical variation.
Erbe, Aaron L., Imonigie, Jerome A., Miranda, Peter A., Moll, Amy J.   +3 more
core   +1 more source

Extraction of contact resistance in carbon nanofiber via interconnects with varying lengths [PDF]

, 2010
A method to extract the contact resistance and bulk resistivity of vertically grown carbon nanofibers (CNFs) or similar one-dimensional nanostructures is described.
Khera, Vinit, Krishnan, Shoba, Li, Ken, Sun, Xuhui, Wilhite, Patrick, Yang, Cary Y.   +5 more
core   +1 more source