Results 111 to 120 of about 2,760 (214)

Research on the Application of Diamond Film in Chemical Mechanical Polishing. [PDF]

Nanomaterials (Basel)
Wang Y, Zhang X, Guo F, Zhang M, Sun X, Zhang L, Xia G, Chai X, Wang S, Zhou X, Gai Z.   +10 more
europepmc   +1 more source

CMOS-Compatible Fabrication Module for Sub-100 nm TiN and TaN Pillar Electrodes for Carbon Nanotube Test Structures. [PDF]

Nanomaterials (Basel)
Chen G, Fujii T, Yamada T, Hata K.
europepmc   +1 more source

The Effects of Friction and Temperature in the Chemical-Mechanical Planarization Process. [PDF]

Materials (Basel), 2023
Ilie F, Minea IL, Cotici CD, Hristache AF.   +3 more
europepmc   +1 more source

Polymer Nanoparticles Applied in the CMP (Chemical Mechanical Polishing) Process of Chip Wafers for Defect Improvement and Polishing Removal Rate Response. [PDF]

Polymers (Basel), 2023
Chiu WL, Huang CI.
europepmc   +1 more source

Fusion of Physical Mechanism and Data-Driven Methods for Online Thickness Measurement and Error Compensation in SiC CMP. [PDF]

Micromachines (Basel)
Lin J, Chen T, Ren Y, Song Z, Lyu B, Yuan J, Zhao W.   +6 more
europepmc   +1 more source

Tapered Cladding Design for Monolithic Waveguide-Photodetector Coupling in Si-Based Integrated Photonics. [PDF]

Nanomaterials (Basel)
Gonzalez-Fernandez AA, Vazquez-Hernandez JA, Aguilar-Valdez F, Moffat N.   +3 more
europepmc   +1 more source

Raised or recessed? Finding the optimal gate architecture for improving the static performance of graphene transistors. [PDF]

Nanoscale Adv
Huang TJ, Spencer A, Ingraham L, Pacheco-Sanchez A, Puchades I.   +4 more
europepmc   +1 more source

A Comprehensive Review of the Nano-Abrasives Key Parameters Influencing the Performance in Chemical Mechanical Polishing. [PDF]

Nanomaterials (Basel)
Bellahsene H, Sene S, Félix G, Larionova J, Ferrari M, Guari Y.   +5 more
europepmc   +1 more source

Controllable Synthesis of Monodisperse CeO₂ Nanoparticles with Tunable Sizes for Chemical-Mechanical Polishing. [PDF]

ACS Omega
Ma Y, Qiu T, Zhao Z, Zou Q, Chen B, Sun Q, Zhao S.   +6 more
europepmc   +1 more source

Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding. [PDF]

Micromachines (Basel)
Zheng T, Xu Y, Mei C, Chen Y, Chang L, Yang G, Hu Q, Shi T, Yuan Y, Yu Z, Li L.   +10 more
europepmc   +1 more source