Tribo-Electrochemical Mechanism of Material Removal Examined for Chemical Mechanical Planarization of Stainless-Steel Using Citrate Buffer as a Complexing Agent. [PDF]
Materials (Basel)Santefort DR, Gamagedara KU, Roy D.
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A Pathway for the Integration of Novel Ferroelectric Thin Films on Non-Planar Photonic Integrated Circuits. [PDF]
Micromachines (Basel)Lievens E +10 more
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Wafer-scale integration of photonic integrated circuits and atomic vapor cells. [PDF]
NanophotonicsGrosman A +4 more
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Prediction Model and Experimental Verification of Surface Roughness of Single Crystal Diamond Chemical Mechanical Polishing Based on Archimedes Optimization Algorithm. [PDF]
Micromachines (Basel)Li Z +5 more
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Emerging Copper-to-Copper Bonding Techniques: Enabling High-Density Interconnects for Heterogeneous Integration. [PDF]
Nanomaterials (Basel)Bao W, Zhang J, Wong H, Liu J, Li W.
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ソクテイ データ ヲ モチイタ ハイセン ケイジョウ バラツキ ノ モデルカ オヨビ ヨクセイ シュホウ ニ カンスル ケンキュウ [PDF]
フクダ, ダイスケ, 福田, 大輔
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TCAD Simulation of STI Depth and SiO<sub>2</sub>/Silicon Interface Trap Modulation Effects on Low-Frequency Noise in HZO-Based Nanosheet FETs. [PDF]
Nanomaterials (Basel)Lee W, Lee J.
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Mechanisms of Chemically Promoted Material Removal Examined for Molybdenum and Copper CMP in Weakly Alkaline Citrate-Based Slurries. [PDF]
Materials (Basel)Gamagedara KU, Roy D.
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Study on polishing mechanisms of BEOL metal interconnects based on chemical and mechanical synergy. [PDF]
Microsyst NanoengTian Z +5 more
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Controlled Synthesis and Formation Mechanism of Uniformly Sized Spherical CeO<sub>2</sub> Nanoparticles. [PDF]
Materials (Basel)Xie J +6 more
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