Results 131 to 140 of about 2,760 (214)

Integration and electrical evaluation of WS₂ and MoS₂ fets in a 300 mm pilot line. [PDF]

Discov Electron
Schram T, Smets Q, Opdebeeck A, Ghosh S, Groven B, Kumar P, Medina HM, Cott D, deMarneffe JF, Dongre H, Kruv A, Panarella L, Pinotti LF, Morin P, Kar GS, Lockhart de la Rosa CJ.   +15 more
europepmc   +1 more source

Development of Green Chemical Mechanical Planarization (CMP) Process using Minimum Quantity Slurry Mist

World Congress on Mechanical, Chemical, and Material Engineering, 2018
Haedo Jeong, Dasol Lee, Hyunseop Lee
openaire   +1 more source

Methods for Enhancing the Formation of Hydroxyl Radicals When Polishing Single Crystal SiC. [PDF]

Materials (Basel)
Shi D, Feng K, Zhao T.
europepmc   +1 more source

Novel Probability Density Function of Pad Asperity by Wear Effect over Time in Chemical Mechanical Planarization. [PDF]

Materials (Basel)
Jeong S, Shin Y, Jeong J, Jeong S, Jeong H.   +4 more
europepmc   +1 more source

Using the node importance of patent network to evaluate patent relational value. [PDF]

PLoS One
Guo J.
europepmc   +1 more source

Heterogeneously-integrated lasers on thin film lithium niobate. [PDF]

Nanophotonics
Li M, Xiang C, Guo J, Peters J, Dumont M, Xue S, Staffa J, Hu Q, Gao Z, Lin Q, Bowers JE.   +10 more
europepmc   +1 more source

Investigation of the Visible Photocatalytic-Fenton Reactive Composite Polishing Process for Single-Crystal SiC Wafers Based on Response Surface Methodology. [PDF]

Micromachines (Basel)
Han Z, Ran B, Pan J, Zhuang R.
europepmc   +1 more source

Constitutive Model of Secondary Annealing Behavior of Cu-Cu Joints in Cu/SiO₂ Hybrid Bonding. [PDF]

Materials (Basel)
Hao Y, Chen S, Li C, Chen Z, Qin F, Chen P, Tian R, Li Z.   +7 more
europepmc   +1 more source

Effect of Structurally Modified Toluene Diisocyanate-Based Polyurethane Pads on Chemical Mechanical Polishing of 4H Silicon Carbide Substrate. [PDF]

Polymers (Basel)
Meng Y, Zhang S, Zhang Z.
europepmc   +1 more source