The Stability Evaluation of Ceria Slurry Using Polymer Dispersants with Varying Contents for Chemical Mechanical Polishing Process. [PDF]
Hwang S, Park J, Kim W.
europepmc +1 more source
Investigation the CMP process of 6 H-SiC in H2O2 solution with ReaxFF molecular dynamics simulation. [PDF]
Gu Y +5 more
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Chemical Mechanical Polishing of Zerodur<sup>®</sup> Using Silica and Ceria Nanoparticles: Toward Ultra-Smooth Optical Surfaces. [PDF]
Bellahsene H +10 more
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Characterization of Ceria Nanoparticles as Abrasives Applied with Defoaming Polymers for CMP (Chemical Mechanical Polishing) Applications. [PDF]
Hwang S, Kim W.
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Morphology and Mechanics of Star Copolymer Ultrathin Films Probed by Atomic Force Microscopy in the Air and in Liquid. [PDF]
Albonetti C +5 more
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A Systematic Study of the Factors Affecting the Surface Quality of Chemically Vapor-Deposited Diamond during Chemical and Mechanical Polishing. [PDF]
Yuan Z, Cheng Z, Feng Y.
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Numerical Simulation and Experimental Study on Picosecond Laser Polishing of 4H-SiC Wafer. [PDF]
Yan Y +5 more
europepmc +1 more source
Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers. [PDF]
Chen H +6 more
europepmc +1 more source
Interaction mechanism of Al2O3 abrasive in tantalum chemical mechanical polishing. [PDF]
Lei R +7 more
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