Results 11 to 20 of about 2,760 (214)
Role of the Oxidation State in Cobalt Chemical Mechanical Planarization
MetalMatCobalt (Co) is a promising next‐generation contact metal to replace tungsten for the system‐large‐scale integration devices beyond the 5 nm technology node due to its low resistivity and high gap‐filling capability at high aspect ratios.
Ganggyu Lee +7 more
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Applied Sciences, 2021 Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically.
Seonho Jeong +3 more
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Correlation between pattern density and linewidth variation in silicon photonics waveguides [PDF]
, 2020 We describe the correlation between the measured width of silicon waveguides fabricated with 193 nm lithography and the local pattern density of the mask layout.
Bogaerts, Wim +3 more
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Nanomaterials, 2021 For scaling-down advanced nanoscale semiconductor devices, tungsten (W)-film surface chemical mechanical planarization (CMP) has rapidly evolved to increase the W-film surface polishing rate via Fenton-reaction acceleration and enhance nanoscale-abrasive
Seong-In Kim +7 more
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Applied Sciences, 2022 Topography of tungsten should be assured at a minimum through chemical mechanical planarization (CMP) in the metal gate structures (e.g., buried gates, replacement metal gates) and via contact in the middle of line (MOL) process for sub−7 nm ...
Kangchun Lee, Jihoon Seo
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Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System
Applied Sciences, 2020 This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure
Chao-Chang A. Chen +4 more
doaj +1 more source
Scratch formation and its mechanism in chemical mechanical planarization (CMP) [PDF]
Friction, 2013 Abstract Chemical mechanical planarization (CMP) has become one of the most critical processes in semiconductor device fabrication to achieve global planarization. To achieve an efficient global planarization for device node dimensions of less than 32 nm, a comprehensive understanding of the physical, chemical, and tribo-mechanical/chemical ...
Kwon, Tae-Young +2 more
openaire +1 more source
Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies
Micromachines, 2022 Chemical mechanical polishing (CMP) is a well-known technology that can produce surfaces with outstanding global planarization without subsurface damage.
Chi-Hsiang Hsieh +5 more
doaj +1 more source
Lubricants, 2017 This paper provides a tribochemical study of the selective layer surface by chemical mechanical planarization (CMP). CMP is used to remove excess material obtained in the process of selective transfer.
Filip Ilie, George Ipate
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Microstructural Effects During Chemical Mechanical Planarization of Copper [PDF]
, 2010 Novel die-stacking schema using through-wafer interconnects require vias to be filled with electroplated Cu, resulting in thick copper films, and requiring an aggressive first-step CMP.
Andersen, Patrick J. +3 more
core +2 more sources