Results 31 to 40 of about 2,760 (214)

Review on modeling and application of chemical mechanical polishing

Nanotechnology Reviews, 2020
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang, Wei Zhen, Wang Weilei, Feng Daohuan, Xu Aoxue, Liu Weili, Song Zhitang   +6 more
doaj   +1 more source

Double-walled carbon nanotube-based polymer composites for electromagnetic protection. [PDF]

, 2010
In this paper, we present a microwave absorber based on carbon nanotubes (CNT) dispersed inside a BenzoCycloButenw (BCB) polymer. The high aspect ratio and remarkable conductive characteristics of CNT give rise to good absorbing properties for ...
Bianco, Bordas, David Dubuc, Emmanuel Flahaut, Grenier, Katia Grenier, Pacchini, Said, Stauffer, Sébastien Pacchini, Yao   +10 more
core   +2 more sources

Synthesis and Characterization of SiO2 Nanoparticles and Their Efficacy in Chemical Mechanical Polishing Steel Substrate

Advances in Materials Science and Engineering, 2014
Chemical mechanical polishing (CMP) technology is extensively used in the global planarization of highly value-added and large components in the aerospace industry. A nanopowder of SiO2 was prepared by the sol-gel method and was compounded into polishing
M. J. Kao, F. C. Hsu, D. X. Peng
doaj   +1 more source

Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire

Friction, 2017
The chemical mechanical polishing (CMP) process has become a widely accepted global planarization technology. The abrasive material is one of the key elements in CMP.
Baichun Zhang, Hong Lei, Yi Chen
doaj   +1 more source

Fenton Reaction for Enhancing Polishing Rate and Protonated Amine Functional Group Polymer for Inhibiting Corrosion in Ge₁Sb₄Te₅ Film Surface Chemical-Mechanical-Planarization

Applied Sciences, 2021
A Fenton reaction and a corrosion inhibition strategy were designed for enhancing the polishing rate and achieving a corrosion-free Ge1Sb4Te5 film surface during chemical-mechanical planarization (CMP) of three-dimensional (3D) cross-point phase-change ...
Gi-Ppeum Jeong, Young-Hye Son, Jun-Seong Park, Pil-Su Kim, Man-Hyup Han, Seong-Wan Hong, Jin-Hyung Park, Hao Cui, Bo-Un Yoon, Jea-Gun Park   +9 more
doaj   +1 more source

Co-integration of Ge detectors and Si modulators in an advanced Si photonics platform [PDF]

, 2012
A Si photonics platform is described, co-integrating advanced passive components with Si modulators and Ge detectors. This platform is developed on a 200mm CMOS toolset, compatible with a 130nm CMOS baseline.
Absil, Philippe, Bogaerts, Wim, De Heyn, Peter, Dumon, Pieter, Lepage, Guy, Pantouvaki, Marianna, Selvaraja, shankar kumar, Van Campenhout, Joris, Verheyen, Peter   +8 more
core   +1 more source

Nanoscale tribological aspects of chemical mechanical polishing: A review

Applied Surface Science Advances, 2022
The semiconductor industry is the backbone of exponentially growing digitization. Countries from the east and the west both are investing significantly to accelerate this growth.
Debottam Datta, Himanshu Rai, Swarnima Singh, Meenakshi Srivastava, Rajesh Kumar Sharma, Nitya Nand Gosvami   +5 more
doaj   +1 more source

Copper removal from semiconductor CMP wastewater in the presence of nano-SiO2 through biosorption

Water Reuse, 2021
Copper-bearing wastewater from chemical mechanical planarization (CMP) is a typical semiconductor development byproduct. How to effectively treat Cu2+ in the CMP wastewater is a great concern in the microchip manufacturing industry.
Xiaoyu Wang, Gude Buer, Wei Fan, Lei Gao, Mingxin Huo   +4 more
doaj   +1 more source

Effect of slurry composition on the chemical mechanical polishing of thin diamond films [PDF]

, 2017
Nanocrystalline diamond (NCD) thin films grown by chemical vapour deposition (CVD) have an intrinsic surface roughness, which hinders the development and per- formance of the films' various applications.
Borri, Paola, Brousseau, Emmanuel Bruno Jean Paul, Davies, Philip Rosser, Lewis, Ryan, Mandal, Soumen, Thomas, Evan L. H., Werrell, Jessica, Williams, Oliver Aneurin   +7 more
core   +1 more source

Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization

Lubricants
Chemical–mechanical planarization (CMP) is used to smoothen the topographies of a rough surface by combining several functions of tribology (friction, lubrication), chemistry, and electrochemistry (corrosion, wear, tribo-corrosion).
Kassapa Gamagedara, Dipankar Roy
doaj   +1 more source