Results 41 to 50 of about 2,760 (214)
Load Assisted Dissolution AND Damage of Copper Surface under Single Asperity Contact: Influence of Contact Loads and Surface Environment [PDF]
, 2012 Copper has become a widely used material in advanced submicron multilevel technologies due to its low resistivity and high electromigration resistance.
Chandra, Abhijit +3 more
core +2 more sources
Functional Metal Complexes for Solar–Light‐Driven Energy Conversion
Advanced Materials, EarlyView.This review provides an exhaustive summary of the recent advancements of functional metal complexes in solar‐to‐electrical, ‐chemical, and ‐thermal energy conversion, comprising material categories, design strategies, underlying principles of operation, and identified improvement of performances.
Yanyan Qin +3 more
wiley +1 more source
Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process
Applied Sciences, 2023 The effect of the two-way injection method during a copper chemical mechanical planarization (CMP) process was investigated. The two-way slurry-injection method has the advantage of not only preventing the degradation of the slurry, but also shortening ...
Chulwoo Bae +4 more
doaj +1 more source
Characterization Of Thermal Stresses And Plasticity In Through-Silicon Via Structures For Three-Dimensional Integration [PDF]
, 2014 Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause ...
Ho, P. S. +4 more
core +1 more source
Advanced Materials, EarlyView.This review highlights the integration of metal‐organic frameworks (MOFs) and two‐dimensional (2D) materials through dimensional interface engineering. By addressing intrinsic limitations like poor conductivity and agglomeration, these hybrid architectures optimize interfacial charge and mass transport.
Prashant Dubey +7 more
wiley +1 more source
, 2011 We use ultra-high vacuum chemical vapor deposition to grow polycrystalline silicon carbide (SiC) on c-plane sapphire wafers which are then annealed between 1250 and 1450{\deg}C in vacuum to create epitaxial multilayer graphene (MLG).
Breslin, Christopher M. +8 more
core +1 more source
Technology platform for the fabrication of titanium nanostructures [PDF]
, 2011 : This paper presents two approaches for the fabrication of top-down titanium nanostructures. The first approach involves electron beam lithography followed by a tailored titanium plasma etching.
Bourque, Frédéric +6 more
core +2 more sources
Advanced Materials, EarlyView.We present a microfabrication and integration strategy for lead halide perovskite photodetectors on electronic readouts. Standard photolithography, aqueous processing, selective transparent electrode etching, and plasma‐assisted pixel isolation enable precise monolithic integration of patterned 400 × 400 perovskite microphotodetector arrays on a CMOS ...
Sergey Tsarev +14 more
wiley +1 more source
Scientific Reports, 2021 Face-centered-cubic crystallized super-fine (~ 2 nm in size) wet-ceria-abrasives are synthesized using a novel wet precipitation process that comprises a Ce4+ precursor, C3H4N2 catalyst, and NaOH titrant for a synthesized termination process at ...
Young-Hye Son +8 more
doaj +1 more source
Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures [PDF]
, 2004 Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS).
Boning, Duane S., Tang, Brian D.
core