Results 51 to 60 of about 2,760 (214)
Advanced Science, EarlyView.A new vertical transistor design with a dual‐modulation strategy is proposed to overcome the limitations of conventional transistors. This architecture uses a micro‐hole patterned electrode and a graphene electrode to enhance channel control and incorporates a leakage blocking layer to suppress off‐state current.
Goeun Pyo +6 more
wiley +1 more source
Electrochemical Nanomachining based on Redox Hydrogel Nanofilm: Copper Planarization with nano-precision [PDF]
, 2013 纳米加工要求能够在纳米或分子、原子水平上可控地实现材料的去除、形变或增添。材料去除是目前最常用的加工手段，其特征是将材料表面的一部分与本体之间的化学或金属键打开，并将之移离。按开键原理，相关的加工可大致分为机械、能量束（离子、激光、电子等）、电化学和化学等方法，并有着各自的优缺点，如：机械和能量束法加工精度高，但会造成加工面的损伤，电化学和化学方法则相反。 近年来，飞速发展的各应用领域对加工后的表面质量要求急剧提高，特别是超大规模集成电路制造中的铜互连导线以及高能激光应用中的发/反射镜面 ...
张红万
core
Fabrication and characterization of on-chip silicon nitride microdisk integrated with colloidal quantum dots [PDF]
, 2015 International ...
Aubert, Tangi +5 more
core +2 more sources
Fabrication of High‐Density Multimodal Neural Probes Based on Heterogeneously Integrated CMOS
Advanced Science, EarlyView.A chiplet‐based methodology democratizes active neural probe development on standard bulk CMOS services. This yields the first probe combining high‐density electrophysiology (416 electrodes) with calcium imaging (832 photodiodes) and complete on‐chip signal processing across 13 shanks.
Ju Hee Mun +10 more
wiley +1 more source
Sensors, 2023 The material removal rate (MRR) is an important variable but difficult to measure in the chemical–mechanical planarization (CMP) process. Most data-based virtual metrology (VM) methods ignore the large number of unlabeled samples, resulting in a waste of
Chunpu Lv +4 more
doaj +1 more source
A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing [PDF]
, 2005 The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as
Chun, Jung-Hoon +2 more
core +1 more source
Single-charge devices with ultrasmall Nb/AlOx/Nb trilayer Josephson junctions
, 2004 Josephson junction transistors and 50-junction arrays with linear junction dimensions from 200 nm down to 70 nm were fabricated from standard Nb/AlOx/Nb trilayers.
A. B. Zorin +4 more
core +1 more source
Vertical liquid controlled adiabatic waveguide coupler [PDF]
, 2018 A broadband vertical liquid controlled optical waveguide coupler (LCC) is demonstrated. The fabricated vertical LCC with silicon nitride (SiN) waveguides can switch light between 2 stacked photonic circuit layers with zero energy consumption in a steady ...
Arce, Cristina Lerma +5 more
core +2 more sources
Carbon Energy, EarlyView.Keggin‐type Al‐POM‐coated silica achieves selective surface oxidation of amorphous carbon through electrostatic attraction and proton‐coupled oxidation, tailoring interfacial properties for lithium‐ion batteries and semiconductor processes. ABSTRACT Amorphous carbon is widely used in energy storage and semiconductor technologies, where surface ...
Ganggyu Lee +13 more
wiley +1 more source
Monolithic Integration of ScAlN Modulators on Silicon‐On‐Insulator Platform
Laser &Photonics Reviews, EarlyView.Monolithic integration of scandium‐doped aluminum nitride (ScAlN) modulators on a silicon‐on‐insulator platform is reported. A multilayer electrode design enhances RF‐optical field overlap, enabling direct access to the diagonal electro‐optic coefficient and improved modulation efficiency.
Sihao Wang +6 more
wiley +1 more source