Results 41 to 50 of about 119,632 (296)

Numerical Simulation and Experimental Study on Chip Radiator with Enhanced Heat Transfer Structure

open access: yesZhileng xuebao, 2015
The heat dissipation of super or large computer server CPU has become the bottleneck for the development of high performance computer, therefore the cooling of super or large computer server attracted more and more attention.
Zhu Kai   +4 more
doaj   +2 more sources

Integrated closed cooling system for high-power chips

open access: yesCase Studies in Thermal Engineering, 2021
With the innovation of high power and high integration for chips in microwave devices, the research of high-efficiency integrated cooling system is advancing.
Rui Wang   +3 more
doaj   +1 more source

Energy challenges for ICT [PDF]

open access: yes, 2017
The energy consumption from the expanding use of information and communications technology (ICT) is unsustainable with present drivers, and it will impact heavily on the future climate change. However, ICT devices have the potential to contribute signi -
Fagas, Giorgos   +3 more
core   +5 more sources

The cooperative regulation of miR‐221 by APE1 and AUF1 impacts p27Kip1 defining a miR signature relevant for cervical cancer

open access: yesFEBS Open Bio, EarlyView.
A regulatory axis involving APE1, AUF1, and miR‐221 is proposed. Pri‐miR‐221 is processed by DROSHA and DICER to generate mature miR‐221, which targets p27Kip1 mRNA. APE1 and AUF1 compete for pre‐miR‐221 binding. Reduced APE1/AUF1 levels impair miR‐221 biogenesis, decrease p27Kip1 mRNA degradation, and promote cell cycle progression, chemoresistance ...
Matilde Clarissa Malfatti   +3 more
wiley   +1 more source

Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger

open access: yesEnergies
Current manufacturing trends in 3D integration are resulting in a notorious increase in power density, and the use of conventional cooling methods may not be sufficient for cooling future 3D ICs with several chip dies. Moreover, with very thin chip dies,
Piotr Zając, Wojciech Zabierowski
doaj   +1 more source

On-chip waste heat-driven absorption cooling system for sustainable data center environment: simulation

open access: yesInternational Journal of Sustainable Engineering, 2018
Development of waste heat-driven absorption-based cooling system is inspired for the need of removing high heat flux from the sustainable data centre environment.
S. Manu, T. K. Chandrashekar
doaj   +1 more source

Promiscuous stimulation of HSP70 ATPase activity by parasite‐derived J‐domains

open access: yesFEBS Open Bio, EarlyView.
The malaria parasite Plasmodium falciparum exports three highly homologous yet functionally divergent J‐domain proteins into human erythrocytes. Here, we show that J‐domains isolated from all three proteins effectively stimulate the ATPase activity of both endogenous host and exported parasite HSP70 chaperones.
Julian Barth   +6 more
wiley   +1 more source

Experimental Evaluation of 100Cr6 Steel Microindented Surfaces Under Lubricated Nonconformal Point Contacts

open access: yesAdvanced Engineering Materials, EarlyView.
The tribological behavior of 100Cr6 steel spheres textured via Vickers microindentation is evaluated under lubricated sliding by varying both dimple size and density. Fine and dense textures significantly reduce friction across all lubrication regimes, while large dimples increase it.
Farideh Davoodi   +3 more
wiley   +1 more source

Innovative Processing of Compacted Waste Aluminum Alloy Powders via Controlled Remelting and Solidification

open access: yesAdvanced Engineering Materials, EarlyView.
This study demonstrates an efficient recycling route for out‐of‐spec AlSi10Mg atomized powders through compaction and arc remelting followed by suction casting. By correlating compaction load, cooling rate, and resulting microstructure, we show that intermediate pressures (50–80 kN) and rapid cooling refine dendrites, reduce porosity, and enhance ...
Mila Christy de Oliveira   +4 more
wiley   +1 more source

Latest Research Advancement and Assessment of Chip Cooling Techniques

open access: yesZhileng xuebao, 2004
Improvement on the chip integration density has to face the restriction from the thermal barrier caused by the heat generation within the electronic elements.
李腾, 刘静
doaj   +2 more sources

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