Results 21 to 30 of about 119,632 (296)

Modeling and Performance Analysis of a Pump-Driven Chip-Level Two-Phase Cooling System in Data Centers

Applied Sciences, 2023
As a powerful solution for heat dissipation in data centers, chip-level cooling continues to capture escalating attention in research and application domains.
Leixin Wang, Hao Cheng, Tongzhi Yang, Weixing Yuan, Kexian Ren   +4 more
doaj   +1 more source

Tool wear investigation in high-pressure jet coolant assisted machining Ti2AlNb intermetallic alloys based on FEM

International Journal of Lightweight Materials and Manufacture, 2018
The excellent mechanical properties of Ti2AlNb intermetallic compounds are beneficial to improve the performance of aero-engine. However, because of their high strength ratio especially at high temperature along with the low thermal conductivity of ...
Jiuhua Xu, Linjiang He, Honghua Su, Liang Zhang   +3 more
doaj   +1 more source

Cold molecular ions on a chip [PDF]

, 2014
We report the sympathetic cooling and Coulomb crystallization of molecular ions above the surface of an ion-trap chip. N$_2^+$ and CaH$^+$ ions were confined in a surface-electrode radiofrequency ion trap and cooled by the interaction with laser-cooled ...
Mokhberi, A., Willitsch, S.
core   +2 more sources

Research on Cryopreservation Conditions of Attached HepG2 Cells on PDMS-glass Microfluidic Chip

Zhileng xuebao, 2020
Efficient cryopreservation of cell samples on microfluidic chips can significantly shorten the cycle of cell experiments on chips, reduce the cost of experiments, which will contribute to the wide application of cell experiments on chips.
Zhou Xinli, Peng Tian, Wang Biao
doaj  

Microfluidic polymerase chain reaction [PDF]

, 2008
We implement microfluidic technology to miniaturize a thermal cycling system for amplifying DNA fragments. By using a microfluidic thermal heat exchanger to cool a Peltier junction, we have demonstrated rapid heating and cooling of small volumes of ...
Gomez, Alvaro, Gomez, Frank A., Maltezos, George, Scherer, Axel, Zhong, Jiang   +4 more
core   +1 more source

Simulation on an Advanced Double-Sided Cooling Flip-Chip Packaging with Diamond Material for Gallium Oxide Devices

Micromachines
Gallium oxide (Ga2O3) devices have shown remarkable potential for high-voltage, high-power, and low-loss power applications. However, thermal management of packaging for Ga2O3 devices becomes challenging due to the significant self-heating effect.
He Guan, Dong Wang, Wentao Li, Duo Liu, Borui Deng, Xiang Qu   +5 more
doaj   +1 more source

Gain spectroscopy of a type-II VECSEL chip

, 2016
Using optical pump-white light probe spectroscopy the gain dynamics is investigated for a VECSEL chip which is based on a type-II heterostructure. The active region the chip consists of a GaAs/(GaIn)As/Ga(AsSb)/(GaIn)As/GaAs multiple quantum well.
A. Rahimi-Iman, A. Ruiz Perez, Born M., C. Berger, C. Fuchs, C. Lammers, C. Möller, Chow W. W., Haug H., J. Hader, J. V. Moloney, Kira M., M. Koch, M. Stein, S. W. Koch, W. Stolz   +15 more
core   +1 more source

Feasibility of detecting single atoms using photonic bandgap cavities [PDF]

, 2004
We propose an atom-cavity chip that combines laser cooling and trapping of neutral atoms with magnetic microtraps and waveguides to deliver a cold atom to the mode of a fiber taper coupled photonic bandgap (PBG) cavity. The feasibility of this device for
, Barclay P E, Barclay P E Srinivasan K Borselli M Painter O, Barclay P E Srinivasan K Borselli M Painter O, Benjamin Lev, Carmichael H, Doherty A C, Folman R, Hideo Mabuchi, Horak P, Kartik Srinivasan, Kimble H J, Lev B, Long R, Long R Reichel J, Lugiato L A, Luo X Krüger P Brugger K Wildermuth S Gimpel H Klein M W Groth S Folman R Bar-Joseph I Schmiedmayer J, Mabuchi H, Mandel L, Metcalf H, Oskar Painter, Paul Barclay, Reichel J, Srinivasan K, Srinivasan K Barclay P E Borselli M Painter O, Vu?kovi? J, Weinstein J D, Wildermuth S Krüger P Becker C Brajdic M Haupt S Kasper A Folman R Schmiedmayer J   +27 more
core   +2 more sources

The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

Energies, 2023
Thermoelectric cooling is an ideal solution for chip heat dissipation due to its characteristics of no refrigerant, no vibration, no moving parts, and easy integration.
Tingzhen Ming, Lijun Liu, Peng Zhang, Yonggao Yan, Yongjia Wu   +4 more
doaj   +1 more source

CMS Barrel Pixel Detector Overview [PDF]

, 2007
The pixel detector is the innermost tracking device of the CMS experiment at the LHC. It is built from two independent sub devices, the pixel barrel and the end disks. The barrel consists of three concentric layers around the beam pipe with mean radii of
B. Meier, Broennimann, Ch. Hörmann, D. Kotlinski, H.Chr. Kästli, K. Gabathuler, Kotlinski, Kästli, P. Robmann, R. Horisberger, S. König, S. Streuli, T. Rohe, W. Bertl, W. Erdmann   +14 more
core   +2 more sources