Results 1 to 10 of about 119,632 (296)
PDMS-PDMS Micro Channels Filled with Phase-Change Material for Chip Cooling [PDF]
Micromachines, 2018 This paper reports on a chip cooling solution using polydimethylsiloxane (PDMS) based microfluidic devices filled with n-Octadecane. A thick SU-8 layer of 150 µm is used as the master mold for patterning PDMS fabrication.
Zong Liu +4 more
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Neural network-based cooling design for high-performance processors
iScience, 2022 Summary: Ultra-high chip power densities that are expected to surpass 1-2kW/cm2 in future high-performance systems cannot be easily handled by conventional cooling methods.
Zihao Yuan, Ayse K. Coskun
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Suitability of Embedded Liquid Cooling and Heat Generation for Chips
Micromachines, 2023 Embedded liquid cooling is a preferred solution for dissipating the heat generated by high-power chips. The cooling capacity and pump power consumption of embedded liquid cooling heat sinks differ significantly between different structures. To achieve an
Jian Zhang +5 more
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Engineering, 2023 The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single
Srikanth Rangarajan +2 more
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Crystals, 2022 Indium tin oxide (ITO) is a functional material with great transparency, machinability, electrical conductivity and thermo–sensitivity. Based on its excellent thermoelectric performance, we designed and fabricated a multilayer transparent microfluidic ...
Tianhang Yang +4 more
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Metals, 2023 Magnesium alloys have broad applications, including medical implants and the aerospace sector owing to their great density and high strength-to-weight ratio. Dry cutting is a frequent technique for machining this material.
Muhammad Syamil Zakaria +3 more
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Comparison of Different Cooling Schemes for AlGaN/GaN High-Electron Mobility Transistors
Micromachines, 2023 Cooling is important for AlGaN/GaN high-electron mobility transistors (HEMTs) performance. In this paper, the advantages and disadvantages of the cooling performance of three cooling schemes: remote cooling (R-cool), near-chip cooling (NC-cool), and chip-
Yunqian Song +6 more
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The Chip Cooling Model and Route Optimization with Digital Microfluidics
Xibei Gongye Daxue Xuebao, 2019 Using microfluidic technology to achieve integrated chip cooling is becoming a promising method to extend Moore law effective period. The thermal management is always critical for 3D integrated circuit design.
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Micro heat exchanger by using MEMS impinging jets [PDF]
, 1999 A micro impinging-jet heat exchanger is presented here. Heat transfer is studied for single jet, slot arrays and jet arrays. In order to facilitate micro heat transfer measurements with these devices, a MEMS sensor chip, which has an 8 x 8 temperature ...
Ho, C. M., Mai, J., Tai, Y. C., Wu, S.
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Case Studies in Thermal Engineering, 2023 The longitudinal vortex generators (LVGs) are introduced in the 3D stacked chip micro gaps to enhance heat transfer. Experimental and numerical tests on the performance of 3D stacked chip with and without LVGs in the gap are conducted, and the flow and ...
Zhongjie Lu +4 more
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