Results 191 to 200 of about 205,612 (304)
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
Highly Sensitive Detection and Discrimination of Cell Suspension Based on a Metamaterials-Based Biosensor Chip. [PDF]
Chen K +6 more
europepmc +1 more source
A dual‐layer living hydrogel, ProΦGel, integrates bacteriophages and probiotics for synergistic wound infection therapy. The outer gelatin‐based matrix releases phages on demand in response to P. aeruginosa infections, while inner alginate beads sustain probiotic delivery.
Siyuan Tao +6 more
wiley +1 more source
On-Chip Microwave Sensing of Nonequilibrium Quasiparticles in α-Tantalum Superconducting Circuits on Silicon for Scalable Quantum Technologies. [PDF]
Poorgholam-Khanjari S +5 more
europepmc +1 more source
This study presents a dynamic interaction between liquid resins and photopolymerized structures enabled by an in situ light‐writing setup. By controlling a three‐phase interface through localized photopolymerization, which provides physical confinement for the remaining uncured resin regions, the approach establishes a programmable pathway that ...
Kibeom Kim +3 more
wiley +1 more source
Modeling and Experimental Investigation of Ultrasonic Vibration-Assisted Drilling Force for Titanium Alloy. [PDF]
Zhai C +8 more
europepmc +1 more source
Tin hexathiophosphate memristors leverage intrinsic nanopores together with a guided filament formation strategy to regulate titanium ion motion and switching behavior. The devices support reliable nonvolatile memory and reconfigurable logic‐in‐memory, demonstrating 14 Boolean logic functions in a single cell.
Thaw Tint Te Tun +7 more
wiley +1 more source
CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage. [PDF]
Wong W, Chiang ST, Huang JCS, Zhou XD.
europepmc +1 more source
A robust solid‐state protein junction with a semi‐transparent eC/Au electrode allows photoexcitation of the bacterio‐rhodopsin, bR layer, to isomerize the bR retinal. The resulting photo‐response shows the protein is functional in the solid‐state junction.
Shailendra K. Saxena +5 more
wiley +1 more source

