Laser‐Induced Forward Transfer (LIFT) is presented as a powerful micropatterning tool. An objective printability framework is developed to assess optimal printing parameter combinations. The technology is further explored for its ability to deterministically deposit microdroplets at predefined locations following CAD designs, enabling the patterning of
Cécile Bosmans +8 more
wiley +1 more source
How wear, age, and sex relate to enamel chipping in Cayo Santiago rhesus macaques (Macaca mulatta). [PDF]
Guatelli-Steinberg D, Fannin LD, Wang Q.
europepmc +1 more source
Microscale Resonator Antenna Array Design on a Silica-Aerogel Substrate for Surface-Enhanced Raman Scattering in the Detection of Diluted Furfural. [PDF]
Klinsuk J +4 more
europepmc +1 more source
Experimental Investigation on Cutting Force and Hole Quality in Milling of Ti-6Al-4V. [PDF]
Zhu L +12 more
europepmc +1 more source
Cutting Force-Vibration Interactions in Precise-and Micromilling Processes: A Critical Review on Prediction Methods. [PDF]
Wojciechowski S +4 more
europepmc +1 more source
Fabrication of Sub-50 nm Three-Dimensional Rhombic Zero-Depth PDMS Nanopores with Enhanced Conductance via Silicon Micro-Blade Molding. [PDF]
Behzadi MM, Renaud P, Taghipoor M.
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Wall Deformation and Minimum Thickness Analysis in Micro-Milled PMMA Microfluidic Devices: A Comparative Study of Milling Strategies. [PDF]
Sucularlı F, Şimşek Ü.
europepmc +1 more source
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Resistor Chips for Thick Film Hybrids
Hybrid Circuits, 1985Applications for thin film resistor chips in thick film hybrid circuits are discussed in relation to the different technologies involved, namely naked and encapsulated forms of mounting.
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Failure Analysis of RuO2 Thick Film Chip Resistors
Microelectronics Reliability, 2004This work presents the results of Failure Analysis carried out on RuO2 Thick Film Chip Resistors in field failed. Microscopical investigation performed on virgin, degraded and open circuit devices showed the failure mechanism involved: evidence for mechanical cracks may be related with the observed degradation and failures.
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