Results 261 to 270 of about 205,612 (304)

Size effect and minimum chip thickness in micromilling

International Journal of Machine Tools and Manufacture, 2015
Abstract This paper compares the size effect behaviour in micro- and macromilling by applying Analysis of Variance on the specific cutting force (kc) and relating it with the tool edge radius (re), workpiece roughness (Ra), cutting force and chip formation when cutting slots in AISI 1045 steel.
Fernando Brandão de Oliveira, Alessandro Roger Rodrigues, Reginaldo Teixeira Coelho, Adriano Fagali de Souza   +3 more
openaire   +1 more source

Determination of the Chip Width and the Undeformed Chip Thickness in Rotational Turning

Key Engineering Materials, 2013
The accurate knowledge of the defining parameters of chip removal in rotational turning is necessary for the description of the complex kinematic relations. In this paper two characteristic parameters of the chip cross-sectional area undeformed equivalent chip thickness, chip width is defined.
István Sztankovics, János Kundrák
openaire   +1 more source

Thick Film/Flip Chips-A Systems Approach

IEEE Transactions on Manufacturing Technology, 1975
Thick-film hybrid integrated circuit process currently being used to realized complex circuit functions in hybrid form is discussed. The thick-film technology, active device attachment, and packaging all play important roles in the overall systems approach. A description of the various processes will be presented starting with the ceramic substrate and
openaire   +1 more source

Predictive modeling of undeformed chip thickness in ceramic grinding

International Journal of Machine Tools and Manufacture, 2012
Abstract The quality of the surface produced during ceramic grinding is important as it influences the performance of the finished part to great extent. The undeformed chip thickness is a variable often used to describe the quality of ground surfaces as well as to evaluate the competitiveness of the overall grinding system.
Sanjay Agarwal, P. Venkateswara Rao
openaire   +1 more source

Chip Carriers Mounted on Large Thick Film Multilayer Boards

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
Two memory systems with 8 MHz clock frequency have been designed. One system contains 67 chip carriers mounted on an alumina substrate 9 x 12.5 cm and the other system contains 79 chip carriers mounted on an alumina substrate 9 x 14 cm. The experiences from the prototype manufacturing and testing are reported.
H. Danielsson, O. Strom
openaire   +1 more source

Thick-Film Chip Resistors: Design, Fabrication and Application

IETE Journal of Research, 1980
Chip resistors are used on PCB's of high frequency circuit advantageously. Design aspects of thick-film resistors for this application are discussed along with their impact on fabrication processes...
openaire   +1 more source

Thick graphene transfer and RIE etching for chip cooling

2013 IEEE International Conference of IEEE Region 10 (TENCON 2013), 2013
Thick graphene which was grown by Chemical Vapor Deposition(CVD) on Nickel substrate and had thickness range about 500nm ~ 1μm was transferred into Si wafer using Hot Pressing with Thermal Release Tape(TRT). After transferring thick graphene into Si wafer, Scotch tape peeling test and Raman spectrum analysis were conducted. Patterning of thick graphene
Woongkyu Choi, Jinwoo Jeong, Kukjin Chun, Byung Do Lee   +3 more
openaire   +1 more source

Estimation of minimum chip thickness in micro-milling using acoustic emission

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 2011
In micro-machining, determination of the minimum chip thickness is of paramount importance, as features having dimensions below this threshold cannot be produced by the process. This study proposes a methodology to determine the value of minimum chip thickness by analysing acoustic emission (AE) signals generated in orthogonal machining experiments ...
Mian, A.J, Driver, N., Mativenga, P.T
openaire   +2 more sources

A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module

Journal of Microelectromechanical Systems, 2010
We develop a cavity chip interconnection technology for thick microelectromechanical systems (MEMS) chip integration. The cavity chip comprising Cu through-silicon via and Cu beam-lead wire was fabricated by micromachining processes. The cavity chip could easily connect a thick MEMS chip with a high step height of more than a few hundred micrometers ...
Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi   +5 more
openaire   +1 more source

An Improved Model of the Chip Thickness in Milling

CIRP Annals, 1995
A new class of comprehensive models proposed in this paper integrates and expands essential features of previously developed analytical and numerical models. The employed systematic modeling methodology facilitates a stepwise and orderly increase of the model's sophistication until the desirable level of performance is achieved.
openaire   +1 more source