Results 31 to 40 of about 205,612 (304)

Atom chips on direct bonded copper substrates

, 2010
We present the use of direct bonded copper (DBC) for the straightforward fabrication of high power atom chips. Atom chips using DBC have several benefits: excellent copper/substrate adhesion, high purity, thick (> 100 microns) copper layers, high ...
Burgess J. F., Evan J. Carlson, James A. Stickney, Karnakis D., Matthew B. Squires, Paul M. Baker, Sandra Wentzell, Steven M. Miller, Walter R. Buchwald   +8 more
core   +1 more source

Light Extraction Efficiency of GaN-Based Micro-Scale Light-Emitting Diodes Investigated Using Finite-Difference Time-Domain Simulation

IEEE Photonics Journal, 2020
We conducted a systematic investigation of the light extraction efficiency (LEE) of GaN-based vertical micro-scale light-emitting diode (μ-LED) structures using three-dimensional finite-difference time-domain (FDTD) simulations. The LEE of μ
Han-Youl Ryu, Jeongsang Pyo, Hyun Yeol Ryu   +2 more
doaj   +1 more source

A Study of Monolithic CMOS Pixel Sensors Back-thinning and their Application for a Pixel Beam Telescope [PDF]

, 2006
This paper reports results on a detailed study of charge collection and signal-to-noise performance of CMOS monolithic pixel sensors before and after back-thinning and their application in a pixel beam telescope for the ALS 1.5 GeV $e^-$ beam test ...
Agostinelli, Benjamin Hooberman, Contarato, Deptuch, Devis Contarato, Dulinski, Gaede, Gornushkin, Kleinfelder, Leo Greiner, Lindsay Glesener, Lutz, Marco Battaglia, Piero Giubilato   +13 more
core   +2 more sources

Stacked Chip-Based Terahertz Metamaterials and Their Application

Photonics, 2023
A terahertz (THz) metamaterial design mechanism based on a stacked chip is proposed. Unlike the traditional sandwich-type metamaterial design mechanism based on the “resonant layer–dielectric layer–ground layer” structure, it adopts a stacked design of ...
Han Wang, Zhigang Wang, Bo Yan, Xinyu Li, Chenrui Zhang, Huiqi Jiang, Minghui Deng, Lesiqi Yin, Cheng Gong   +8 more
doaj   +1 more source

Cutting Forces and Chip Morphology in Medium Density Fiberboard Orthogonal Cutting

BioResources, 2014
The influence of rake angle, cutting speed, and uncut chip thickness on cutting forces and chip morphology in medium density fiberboards orthogonal cutting was investigated.
Yu Teng, Jianwen Ding, Baojin Wang, Xiaolei Guo, Pingxiang Cao   +4 more
doaj   +1 more source

Study on Chip Formation Mechanism of Single Crystal Copper Using Molecular Dynamics Simulations

Nanoscale Research Letters, 2022
Nano-cutting is an important development direction of the modern manufacturing technology. However, the research on the mechanism underlying nano-cutting lags far behind the practical application, which restricts the development of this advanced ...
Peng Zhang, Xinjian Li, Jiansheng Zhang, Yi Zhang, Xiaoguang Huang, Guigen Ye   +5 more
doaj   +1 more source

Crucial parameters for precise copy number variation detection in formalin‐fixed paraffin‐embedded solid cancer samples

Molecular Oncology, EarlyView.
This study shows that copy number variations (CNVs) can be reliably detected in formalin‐fixed paraffin‐embedded (FFPE) solid cancer samples using ultra‐low‐pass whole‐genome sequencing, provided that key (pre)‐analytical parameters are optimized.
Hanne Goris, Vasiliki Siozopoulou, Léon C van Kempen, Anne Sieben, Ella Roelant, Stig Hellemans, Elyne Backx, Laure Sorber, Koen De Winne, Senada Koljenović, Karen Zwaenepoel   +10 more
wiley   +1 more source

Variable-gap bias structure for magnetic bubble memory package [PDF]

, 1975
Size and thickness of field adjusting plate can be varied.
Chen, T. T.
core   +1 more source

The Effect of Sapphire Substrates on Omni-Directional Reflector Design for Flip-Chip Near-Ultraviolet Light-Emitting Diodes

IEEE Photonics Journal, 2019
In this paper, we investigate the effect of omni-directional reflectors (ODRs) on the light extraction efficiency (LEE) for flip-chip near-ultraviolet light-emitting diodes (LEDs) on patterned (PSS) and flat sapphire substrate (FSS) using three ...
Yonghui Zhang, Ji Zhang, Yuxin Zheng, Ce Sun, Kangkai Tian, Chunshang Chu, Zi-Hui Zhang, Jay Guoxu Liu, Wengang Bi   +8 more
doaj   +1 more source

Study of a Methodology for Calculating Contact Stresses during Blade Processing of Structural Steel

Metals, 2023
The article presents data about the distribution of contact stresses on the rake surface of the cutter when turning steel (Fe-0.4 C-1Cr), which were obtained by the split cutter method.
Victor Kozlov, Artem Babaev, Nikita Schulz, Artem Semenov, Anton Shevchuk   +4 more
doaj   +1 more source