Results 151 to 160 of about 4,851,856 (312)
High Aspect Ratio, Superconducting Vacuum Gap Capacitor NEMS with Plate Distances Down to 32 nm
Advanced Materials Technologies, EarlyView.Fabrication of aluminium vacuum gap capacitor based NEMS is investigated with a free to move top electrode. To avoid collapse of the top electrode vertical stress gradient is controlled through sputter parameters. The result is wafer‐level high‐yield fabrication of vacuum gap capacitors with radii between 7 µm and 30 µm and integrated piezoactuators. A
Ioan Ignat, Daniel Platz, Ulrich Schmid
wiley +1 more source
Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications
Advanced Materials Technologies, EarlyView.Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley +1 more source
پیاورد سلامت, 2013 Background and Aim: Citation is one of the journals ranking factors. Self-Citation rates regarding journals `performance, especially in international databases, is important.
Seyed Javad Ghazi Mirsaeid +4 more
doaj
Citation searching and bibliographic coupling with remote on-line computer access
, 1968 Franz L. Alt, Russell A. Kirsch
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Advanced Materials Technologies, EarlyView.The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
wiley +1 more source
Advanced Optical Materials, Volume 13, Issue 8, March 13, 2025.Chalcogenide optical PCMs have gathered interest for their potential in compact, non‐volatile optics and photonics. Free‐space PCM metasurfaces require new considerations from phase change memory that need to be addressed for reliable scale‐up. Several failure mechanisms pertaining to free‐space PCM devices and layout methods are isolated to prevent ...
Cosmin Constantin Popescu +19 more
wiley +1 more source