Results 151 to 160 of about 385,801 (356)
High-temperature Complementary Metal Oxide Semiconductors (CMOS) [PDF]
The results of an investigation into the possibility of using complementary metal oxide semiconductor (CMOS) technology for high temperature electronics are presented. A CMOS test chip was specifically developed as the test bed.
Mcbrayer, J. D.
core +1 more source
Linear CMOS transconductance element for VHF filters [PDF]
, 1989 Bram Nauta, E. Seevinck
openalex +1 more source
Scaled‐Up Graphene Growth Through Chemical Vapor Deposition Over Large‐Area Liquid Cu Catalysts
Advanced Materials Interfaces, EarlyView.Scaling up the catalyst area fivefold and improving molten catalyst cleaning minimize reactor kinetic effects, enabling reaction kinetics to dominate graphene growth. This results in high‐quality graphene with controlled layering and measurable nucleation rates.
Mahesh K. Prabhu +9 more
wiley +1 more source
Understanding the Growth and Properties of Sputter‐Deposited Phase‐Change Superlattice Films
Advanced Materials Interfaces, EarlyView.The study explores the sputter deposition of highly textured chalcogenide superlattice films for phase‐change memory applications. It examines the effects of temperature, pressure, and seeding layer on film growth, constructing a pseudo‐phase diagram to understand the effect of each growth parameter.
Simone Prili +7 more
wiley +1 more source
Delay optimization of combinational static CMOS logic [PDF]
, 1987 Mark Hofmann, J.K. Kim
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The Rise of Refractory Transition‐Metal Nitride Films for Advanced Electronics and Plasmonics
Advanced Materials Interfaces, EarlyView.Transition‐metal nitrides (TMNs) are exceptional materials with high stability, biocompatibility, and semiconductor integration, which have been extensively employed in various fields. However, the epitaxial growth of TMN films remains a challenge. The absence of high‐quality TMNs limits the understanding of their condensed matter physics and hinders ...
Jiachang Bi +3 more
wiley +1 more source
A new approach to derive robust sets for stuck-open faults in CMOS combinational logic circuits [PDF]
, 1989 J. F. Wang, Tsung-Yuan Kuo, J.-Y. Lee
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Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Expansion of CMOS array design techniques [PDF]
The important features of the multiport (double entry) automatic placement and routing programs for standard cells are described. Measured performance and predicted performance were compared for seven CMOS/SOS array types and hybrids designed with the ...
Feller, A., Ramondetta, P.
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