A 1000 word speech recognition system using a special purpose CMOS-processor [PDF]
, 1987 W. Drews +3 more
openalex +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
CHARACTERISATION OF NARROW-SPACED ISOLATION IN A TWIN RETROGRADE WELL SUBMICRON CMOS PROCESS [PDF]
, 1988 P.A. van der Plas +2 more
openalex +1 more source
Photoactive Monolayer MoS2 for Spiking Neural Networks Enabled Machine Vision Applications
Advanced Materials Technologies, EarlyView.Molybdenum disulfide (MoS2) optoelectronic devices are implemented as Leaky Integrate‐and‐Fire (LIF) neurons in spiking neural networks (SNNs), where light‐induced photocurrent dynamics represent potentiation (τd) and depression (τd), emulating neuronal membrane potential.
Thiha Aung +5 more
wiley +1 more source
HIGHER EFFICIENCY OF CMOS-PROCESS-COMPATIBLE PHOTODIODES IN SOI-TECHNIQUE BY REFLECTING FILMS [PDF]
, 1988 K. Knospe, K. Goser
openalex +1 more source
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Advanced Materials Technologies, EarlyView.Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek +4 more
wiley +1 more source
High Aspect Ratio, Superconducting Vacuum Gap Capacitor NEMS with Plate Distances Down to 32 nm
Advanced Materials Technologies, EarlyView.Fabrication of aluminium vacuum gap capacitor based NEMS is investigated with a free to move top electrode. To avoid collapse of the top electrode vertical stress gradient is controlled through sputter parameters. The result is wafer‐level high‐yield fabrication of vacuum gap capacitors with radii between 7 µm and 30 µm and integrated piezoactuators. A
Ioan Ignat, Daniel Platz, Ulrich Schmid
wiley +1 more source
Fabrication and Evaluation of the ECL/TTL Compatible BI-CMOS Gate Array
, 1988 Y. Sugimoto +3 more
openalex +2 more sources
Advances in Halide Perovskites for Photon Radiation Detectors
Advanced Materials Technologies, EarlyView.This work highlights recent progress in perovskite‐based photon radiation detectors, covering organic–inorganic hybrid, inorganic, lead‐free double, and vacancy‐ordered halide perovskites. Their detection performance is compared, material‐specific advantages and challenges are examined, and provides insight into current limitations and future ...
Liangling Wang +3 more
wiley +1 more source