Results 101 to 110 of about 72,784 (298)

Ultrathin Monatomic Antimony Films by Sacrificial Atomic Layer Deposition for Phase Change Memory

Advanced Materials, EarlyView.
A three‐step sacrificial atomic layer deposition (s‐ALD) process enables wafer‐scale growth of ultrathin and uniform antimony (Sb) thin films. An ultrathin (≈4 nm) Sb film is uniformly deposited with its characteristic bilayer structure (Sb‐Sb) aligned along the substrate.
Gwangsik Jeon, Sangmin Jeon, Seunghwan Lee, Jeong Woo Jeon, Wonho Choi, Byongwoo Park, Sungjin Kim, Chanyoung Yoo, Hyejin Jang, Cheol Seong Hwang   +9 more
wiley   +1 more source

Cryogenic CMOS Integrated Circuits for Scalable Readout of Silicon Quantum Computers

, 2021
Andrea Ruffino
openalex   +2 more sources

High‐κ Perovskite‐Like Ternary Niobium Oxide Dielectrics for 2D Electronics

Advanced Materials, EarlyView.
High‐κ dielectrics are vital for scaled electronics. Here, a family of 2D high‐κ perovskite‐like ternary niobium oxides is synthesized via a molten salt‐assisted method. Their integration into FETs and logic gates reveals superior switching characteristics, providing a fresh material platform and new insights for the advancement of high‐performance 2D ...
Biao Zhang, Jianmiao Guo, Jianmin Yan, Jialiang Wang, Chao Yun, Guang Zeng, Jie Li, Cong Wang, Zhengdao Xie, Yanglong Hou, Yang Chai   +10 more
wiley   +1 more source

Materials and System Design for Self‐Decision Bioelectronic Systems

Advanced Materials, EarlyView.
This review highlights how self‐decision bioelectronic systems integrate sensing, computation, and therapy into autonomous, closed‐loop platforms that continuously monitor and treat diseases, marking a major step toward intelligent, self‐regulating healthcare technologies.
Qiankun Zeng, Hong Liu, Yongheng Zhang, Youbin Zheng, Xuyin Ding, Mengni Zhu, Guoyue Shi, Yan Wang, Hossam Haick, Min Zhang   +9 more
wiley   +1 more source

Design of a dual H-bridge integrated circuit for ultrasonic motor driver

Dianzi Jishu Yingyong
Ultrasonic motor as a new type of motor,the design of motor driver is very important.Based on 0.18 μm HV CMOS process,this article designed a dual H-bridge integrated circuit suitable for ultrasonic motor driver.The integrated circuit contains two ...
Xiao Peilei, Huang Yelin, Ma Wenchao, Zhang Haopu, Xie Yalong   +4 more
doaj   +1 more source

A Library for Designing Automatic CMOS Digital Integrated Circuits Using Genetic Algorithms

, 2023
Ali Mohammadi, S. Sadjad Mehdizadeh
openalex   +1 more source

Ultra‐Sensitive Nanofiber‐Based Triboelectric Nanogenerator for Energy Harvesting and Self‐Powered Sensing

Advanced Materials, EarlyView.
A multidimensional molecular strategy optimizes the tribonegative layer by electrospinning PVDF‐HFP for dipole alignment and crystallinity, followed by 2D borophene doping to enhance conductivity and charge trapping. Integrated with Nylon‐66 nanofibers, the composite device delivers a record sensitivity of 53.8 ± 1.2 V kPa−1 at 3 Hz, enabling ultra ...
Sajib Roy, Bhaskar Dudem, Md Delowar Hussain, Vlad Stolojan, Seyedeh Sadrieh Emadian, Satheesh Krishnamurthy, Jae Sung Yun, S. Ravi P. Silva   +7 more
wiley   +1 more source

Simulation and Realization of Some CMOS-Transconductor Vhf Filters

Active and Passive Electronic Components, 2003
CMOS circuits for integrated analog filters at very high frequencies have been designed through PSPICE based on the Transconductance-C integrator. They have been implemented on the bread board and many filters i.e. LP, BP, Elliptic LP etc.
Umesh Kumar
doaj   +1 more source

Adding New Capabilities to Silicon CMOS Integrated Circuits via Deterministic Programmed Assembly [PDF]

, 2011
Theresa S. Mayer, Jaekyun Kim, Thomas Morrow, Boone Won, Mingwei Li, Wenchong Hu, Xiahua Zhong, Stacey L. Dean, Kaige Sun, Jeffrey Mayer, Christine D. Keating   +10 more
openalex   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya, Adamos Christou, Sihang Ma, Ravinder Dahiya   +3 more
wiley   +1 more source