Robust and Compatible Ferroelectric Memories with Polycrystalline TiO2 Channel for 3D Integration
Advanced Electronic Materials, EarlyView.Robust and monolithic 3D compatible ferroelectric memories are realized using the polycrystalline TiO2 channel‐based FeFET. The review covers physical mechanisms of the TiO2 channel FeFET, quantitative benchmarking, and advanced planar/vertical architectures for monolithic 3D integration based on HfO2‐TiO2 gate stack, offering a roadmap for reliable ...
Xujin Song +10 more
wiley +1 more source
Emerging Memory and Device Technologies for Hardware‐Accelerated Model Training and Inference
Advanced Electronic Materials, EarlyView.This review investigates the suitability of various emerging memory technologies as compute‐in‐memory hardware for artificial intelligence (AI) applications. Distinct requirements for training‐ and inference‐centric computing are discussed, spanning device physics, materials, and system integration.
Yoonho Cho +6 more
wiley +1 more source
Design and Characterization of a Prototype Pixel Readout Chip for Synchrotron Single Photon-Counting Detectors with 50 µm Pitch and 20 e<sup>-</sup>rms ENC Noise. [PDF]
Sensors (Basel)Lu S +5 more
europepmc +1 more source
Advanced Electronic Materials, EarlyView.ABSTRACT With the continuous development of computer image processing, developing efficient and low‐power computing devices has become a key challenge. Memristors have integrated in‐situ storage and computing capabilities, making them an ideal choice for low‐power image processing computing architectures. However, current memristors are confronted with
Tengyu Li +4 more
wiley +1 more source
An Integrated Photo-Magnetic Sensor Chip Using Giant Magnetoresistance (GMR) and Light-Dependent Resistor (LDR) Technologies Based on Microfabrication Compatibility. [PDF]
Micromachines (Basel)Sun X +6 more
europepmc +1 more source
Analog Weight Update Rule in Ferroelectric Hafnia, Using picoJoule Programming Pulses
Advanced Electronic Materials, EarlyView.Resistive, ferroelectric synaptic weights based on BEOL‐compatible hafnia/zirconia nanolaminates are fabricated. Lateral downscaling the devices below 10 µm2 enables 20 ns programming with electrical pulses, dissipating ≤ 3 pJ. Experimental results show that final conductance state is set by pulse amplitude, and is largely independent of the initial ...
Alexandre Baigol +7 more
wiley +1 more source
Slow-Light Mid-IR Silicon Photonic Chips for NO<sub>2</sub> and CH<sub>4</sub> Gas Detection. [PDF]
ACS OmegaFan KC +4 more
europepmc +1 more source
Advanced Electronic Materials, EarlyView.In this work, low‐resolution infrared imaging is combined with a 28 nm FeFET IMC architecture to enable compact, energy‐efficient edge inference. MLC FeFET devices are experimentally characterized, and controlled multi‐level current accumulation is validated at crossbar array level.
Alptekin Vardar +9 more
wiley +1 more source
A Rapid-prototyping CMOS-RRAM Integration Strategy. [PDF]
Microsyst NanoengTsiamis A +2 more
europepmc +1 more source