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The influence of CNTs on the thermoelectric properties of a CNT/Bi2Te3 composite
Carbon, 2013Abstract CNT/Bi 2 Te 3 composites were prepared from composite powders in which CNTs were implanted in the Bi 2 Te 3 matrix powders by a novel chemical route. It was found that the fabricated composite had a microstructure of a homogeneous dispersion of CNTs in the Bi 2 Te 3 matrix due to interfacial bonding agents of oxygen atoms attaching to the
CHOI, SI YOUNG +6 more
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Heat Dissipation Mechanism at Supported CNT-CNT Junctions
Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and, 2012The thermal transport at the carbon nanotube (CNT) interfaces such as CNT-oxide and CNT-CNT junctions can significantly impact the device performance and reliability of nanotube network based thin-film transistors. For an example, the high electrical and thermal resistance at CNT junctions can cause hot spots, inefficient heat removal or even breakdown
Satish Kumar, Liang Chen
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Finite element modeling of two different CNT/polymer composites: CNT/PMMA and CNT/PmPV
2011 IEEE Nanotechnology Materials and Devices Conference, 2011Carbon nanotube (CNT) in polymeric matrix is investigating due to improvement of the structural, mechanical, thermal and electronic properties of resulting CNT/polymer composite. This improvement depends on: properties, features and volume fractions of CNTs and polymer. In this paper, there are three main parts for using an analysis on a finite element
A. Nickkholgh, P. Keyvani
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2020
The chapter will start with brief introduction to the interconnects and its importance in an integrated circuit at deep sub-micron technology nodes. The brief discussion about the concept of scaling, interconnects models, and material in use are presented. The limitations of conventional materials at scaled down technology nodes will be discussed next.
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The chapter will start with brief introduction to the interconnects and its importance in an integrated circuit at deep sub-micron technology nodes. The brief discussion about the concept of scaling, interconnects models, and material in use are presented. The limitations of conventional materials at scaled down technology nodes will be discussed next.
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Influence of CNT Diameter and Annealing on the Tensile Property of CNT by Using Untwisted CNT Yarn
The Proceedings of the Materials and Mechanics Conference, 2022Yoshinobu SHIMAMURA +3 more
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Hierarchical construction of CNT networks in aramid papers for high-efficiency microwave absorption
Nano Research, 2023Yixin Han, Panbo Liu, Wenbo Ju
exaly