Results 151 to 160 of about 774,920 (290)

Fluctuating Curvature and Actuation in 4D Printed Asymmetric Networks by Frontal Photopolymerization

open access: yesAdvanced Materials Interfaces, EarlyView.
Asymmetric polymer networks, fabricated by frontal photopolymerization (FPP), are shown to exhibit curvature oscillations associated with monomer‐solvent exchanges during development and drying. We introduce a theoretical model for such dynamic curvature fluctuations and demonstrate the fabrication of bistable switches and self‐propelled materials that
Muhammad Ghifari Ridwan   +3 more
wiley   +1 more source

Combinatorial Screening for Europium Induced Defect Engineering in Titania Anodic Memristors

open access: yesAdvanced Materials Interfaces, EarlyView.
A Ti‐Eu thin‐film combinatorial libary (3‐17 at.% Eu) was fabricated by co‐sputtering and anodisation. Systematic screening revealed forming‐free memristors with analog switching, with compositions between 7‐17 at.% Eu showing improved endurance and multilevel resistive states.
Elena Atanasova   +5 more
wiley   +1 more source

Soft Electromagnetic Actuator and Oscillator

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
This work presents a groundbreaking soft electromagnetic system capable of bistable actuation and self‐regulated oscillation. Using liquid metal and silicone as a compliant conductor, the actuator enables force generation, sensing, and feedback with minimal power.
Noah D. Kohls, Yi Chen Mazumdar
wiley   +1 more source

A standard-based taxonomy of features that affect user response to clinical decision support alerts. [PDF]

open access: yesBMC Med Inform Decis Mak
Liu S   +5 more
europepmc   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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