Results 141 to 150 of about 10,646 (189)
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Formation of ultra-fine copper grains in copper-clad aluminum wire
Scripta Materialia, 2010The microstructure formation at the interface in a copper-clad aluminum bimetallic wire has been investigated. Ultra-fine copper grains with sizes of 200 nm are formed near the Cu/Al interface when the wire is drawn after heat treatment. The formation of the ultra-fine copper grains is attributed to low-temperature recrystallization from strain that ...
T.T. Sasaki +4 more
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Electrical Engineering in Japan, 2023
AbstractThe paper is proposed approximate formulas of the ac resistance of lead wires and coils which made by using copper clad aluminum (CCA) wires. There are the frequency range that the ac resistance of CCA wires is lower than it of cupper solid wires for lead wires and coils of an electrical equipment.
Katsuhiko Ueda, Chefen Hung
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AbstractThe paper is proposed approximate formulas of the ac resistance of lead wires and coils which made by using copper clad aluminum (CCA) wires. There are the frequency range that the ac resistance of CCA wires is lower than it of cupper solid wires for lead wires and coils of an electrical equipment.
Katsuhiko Ueda, Chefen Hung
exaly +4 more sources
Microstructure of aluminum/copper clad composite fabricated by casting-cold extrusion forming
Journal of Central South University of Technology, 2011An aluminum/copper clad composite was fabricated by the casting-cold extrusion forming technology and the microstructures of the products were observed and analyzed. It is found that aluminum grains at the interface are refined in the radial profiles of cone-shaped deformation zone, but the grains in the center maintain the original state and the grain
Jun-ting Luo +2 more
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Study of the intermetallic growth in copper-clad aluminum wires after thermal aging
Intermetallics, 2014Abstract Study of the solid-state diffusion between copper and aluminum was carried out in the temperature range [573–673] K in order to better understand the aging mechanisms which occur in copper-clad aluminum thin wires. A complete microscopic analysis was performed to evaluate the interface composition and corresponding microstructure.
Antoine Gueydan +2 more
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Fabrication of a novel high-strength and high-conductivity copper-clad aluminum composite wire
CIRP Journal of Manufacturing Science and Technology, 2023Farnousheh Sharifian Amiri +3 more
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AC Resistance of Copper Clad Aluminum Wires
IEICE Transactions on Communications, 2013Recently, wireless power transfer has attracted much attention for power supplying on not only small electric devices but also large equipments such as electric and hybrid vehicles [1]. Coils are key components in a power transfer system and the AC resistance determines the transferring efficiency.
Ning GUAN +3 more
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Design of Copper-Clad Aluminum Winding Alternator for Vehicle Application
Advanced Materials Research, 2011Copper-clad aluminum wire which is composed of aluminum core clad with ETP copper was exploited to solve the problem of the copper price increasing by replacing traditional copper wire with copper-clad aluminum wire in the alternator for vehicle application. The aluminum winding alternator parameter was designed and the alternator was tested.
Li Wei Shi, Xue Yi Zhang
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Characteristics of copper-clad aluminum rods prepared by horizontal continuous casting
Metals and Materials International, 2017An innovative horizontal continuous casting method was developed and successfully used to prepare copper-clad aluminum (CCA) rods with a diameter of 85 mm and a sheath thickness of 16 mm. The solidification structure and element distribution near the interface of the CCA ingots were investigated by means of a scanning electron microscope, an energy ...
Yubo Zhang +7 more
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Extrusion of copper clad aluminum wire
Journal of Mechanical Working Technology, 1978Abstract This report describes investigation in the extrusion of copper clad aluminum wire. The variables that influence a sound clad extrusion are determined. These variables are (1) die design, (2) extrusion ratio, (3) extrusion pressure, (4) product velocity, (5) percentage copper used, and (6) ratio of flow stress of copper to aluminum.
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