Results 261 to 270 of about 27,473 (304)

Electrodeposition of nickel on copper

Journal of Chemical Education, 1986
In the classroom, one can demonstrate electroplating by the simple, fast, inexpensive, and visually interesting reaction between nickel ions and copper metal.
Joseph Manjkow, Dana Levine
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Sonochemical Electrodeposition of Copper Coatings

Russian Journal of Applied Chemistry, 2018
Potentiodynamic polarization method was used to study kinetic specific features of the electrodeposition of copper under a sonochemical treatment of a sulfuric acid electrolyte. The working current densities, scattering power of the electrolyte, the structure, microhardness, and luster of the formed coatings were determined depending ultrasonic field ...
A. A. Kasach, I. I. Kurilo, D. S. Kharitonov, S. L. Radchenko, I. M. Zharskii   +4 more
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Fractal growth of copper electrodeposits

Nature, 1984
Black dendritic growths of copper were electrodeposited in steady-state diffusion-limited conditions onto an initially point-like cathode. Their spatial extent R was inferred from the increased current and their mass M from the total charge transferred. Fractal behaviour M∝RD was observed with D = 2.43 ±0.03, in good agreement with computer simulations
R. M. Brady, R. C. Ball
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Copper damascene electrodeposition and additives

Journal of Electroanalytical Chemistry, 2003
Copper via filling is one of the most recent nanoscale electrodeposition technologies used in semiconductor fabrication. Sub micrometer vias on silicon wafers serve as digital signal conductors, when filled with copper. The additives in the electrodeposition bath are critical to obtain vias free of voids and defects.
K. Kondo, N. Yamakawa, Z. Tanaka, K. Hayashi   +3 more
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Nitrate Reduction at Electrodeposited Copper on Copper Cathode

ECS Transactions, 2014
We report on the synthesis and characterization of low-cost copper electrodeposited on a copper substrate (Cu/Cu), and its applicability towards nitrate reduction. The surface area of Cu was increased by the electrodeposition of Cu, and at a chosen deposition potential and pH, optimum electrodeposition parameters corresponding to better catalytic ...
Kunjuvaikarar Soundararajan Rajmohan, Raghuram Chetty   +1 more
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Electrodeposited copper individual impression trays

The Journal of Prosthetic Dentistry, 1966
Abstract Individual metal impression trays have been produced by strengthening a preformed brass mesh by electrodeposition of copper. The size of the perforations in the tray are variable and are determined by the mesh selected and the thickness of copper deposited.
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Thermal response of electrodeposited copper

Journal of Electronic Materials, 1995
Thermal response of electrodeposited copper has been characterized by monitoring changes in microstructure, tensile strength, elongation, and microhardness following 30 minute isothermal anneal at temperatures between 23 and 450°C. By judicious control of additives to the electrolyte, considerable enhancements of strength, hardness, and anneal ...
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Copper Electrodeposition from Ammoniacal Electrolytes

ECS Meeting Abstracts
Abstract Electronic waste is considered one of the fastest growing solid wastes due to shortening service lifespan of electronic products and their increased consumption [1]. Currently, there are major gaps in volume of copper produced and recovered in numerous countries worldwide (Wang ...
Sudipta Roy, Bailie Morrison, Todd Green
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Selective Copper Electrodeposition to a 3D Copper Nanostructure

ECS Meeting Abstracts, 2016
Introduction Three-dimensional (3D) copper nanostructures are expected to be applied as current collectors for lithium ion battery anodes due to their high electrical conductivity and large specific surface area. The production of 3D copper nanostructures usually requires complicated fabrication steps; however, we have developed a ...
Yuma Kobayashi, Susumu Arai
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Some observations on copper electrodeposits

Electrochimica Acta, 1961
Abstract Observations of copper electrodeposits produced from acid sulphate baths have revealed some new metallographic features. A growth mechanism involving twinning on {111} planes is proposed to account for the features observed; this mechanism complicates but does not invalidate the bunching mode of growth previously reported.
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