Results 111 to 120 of about 6,768,795 (300)

Estudo computacional de complexos mononucleares de cobre (II) e zinco (II) com ligantes triazólicos [PDF]

, 2013
Dissertação (mestrado) - Universidade Federal de Santa Catarina, Centro de Ciências Físicas e Matemáticas, Programa de Pós-Graduação em Química, Florianópolis, 2013.Neste trabalho foram estudados complexos mononucleares de cobre(II) ou zinco(II ...
Fonseca, David Edson Pedrosa
core  

Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy

Advanced Engineering Materials, EarlyView.
Conventional low‐melting‐point alloys (LMPAs) are limited by a narrow compositional space and inherent property trade‐offs. This review presents an entropy‐driven design strategy that overcomes these limitations, ushering in a new class of low‐melting‐point compositionally complex alloys (LMCCAs).
Yinghui Shang, Jianxiang Zhao, Zhaoqi Chen, Hao Gong, Yinsen Yan, Junlei Tao, Yong Yang   +6 more
wiley   +1 more source

Investigating the Low‐Temperature Phase Stability of the Binary Ta–W System

Advanced Engineering Materials, EarlyView.
Atomistic simulations show that the binary Ta–W system forms ordered intermetallic phases, B2‐TaW and D03‐TaW3, as 0 K ground states. Configurational entropy, however, lowers the free energy of the disordered bcc solid solution, which becomes the stable phase above about 400 K.
Klemens Lechner, Anna Sophie Jelinek, Velislava Terziyska, Peter Wagatha, Wolfram Knabl, Christian Mitterer, Helmut Clemens, David Holec   +7 more
wiley   +1 more source

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

Advanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan, Jiafen Song, Jinglong Li, Jiangtao Xiong, Tao Yang   +4 more
wiley   +1 more source

Effects of Mg on Microstructure and Solidification of a Hypereutectic Zn–8 wt.%Al Alloy

Advanced Engineering Materials, EarlyView.
An appreciable set of results involving thermal data, microstructure, chemical composition, and microstructural growth laws is reported for ZnAlMg alloys. Such results demonstrate that ZnAlMg alloys have high potential for applications in automotive self‐lubricating components, batteries, and electrical systems.
Raí B. de Sousa, Jeverton L. Paixão, Daylla S. Silva, Bruno S. Sobral, Mucio D. de Medeiros, José E. Spinelli, Bismarck L. Silva   +6 more
wiley   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

The Role of Ultra‐Thin Passive Films and Organic Adsorbates on Aluminum Chips for a Friction‐Induced Solid‐State Recycling Process

Advanced Engineering Materials, EarlyView.
Despite benefits to storage stability and handleability of aluminum scrap, octadecyl phosphonic acid (ODPA) SAMs reduce the tensile strength of wires produced using friction‐induced recycling. Etching and methyl diphosphonic acid (MDPA) coatings, however, have little effect.
Timothy D. Goller, Steffen Gabsa, Werner Homberg, Guido Grundmeier   +3 more
wiley   +1 more source

Electrochemical Synthesis and Structural Characterization of the Trinuclear Copper (I)-Copper (II) Complex: bis[bis(triphenylphosphine)copper(I)][bis(thiosalicylate)copper(II)]

, 1998
A novel, symmetrical trinuclear copper(I)-copper(II) com-plex, bis[bis(triphenylphosphine)copper(I)][bis(thiosalicylate)copper(II)], [{Cu(PPh3)2}2{Cu(C7H4O2S)2}], has been prepared by anodic dissolution of copper into a solution of triphenylphosphine and
Healy, PC, Sagatys, DS, Bott, RC, Peter C. Healy, Raymond C. Bott, Dalius S. Sagatys   +5 more
core   +1 more source

Rotary 3D Printing With Integrated Electroplating

Advanced Engineering Materials, EarlyView.
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria, Nicola Larovere, Moslem Mohammadi, Gianluca Percoco, Ali Zolfagharian, Gianni Stano   +5 more
wiley   +1 more source

Electrodeposition in Structural Lattices of Variable Architectures

Advanced Engineering Materials, EarlyView.
Electrodeposition enables geometry‐sensitive, autonomous void filling while simultaneously tuning chemical and mechanical properties. The development of approaches that can autonomously fill and heal material voids and yield composites with tailorable properties is increasingly relevant in engineering.
Yeong‐Man Kwon, Jingwen Zhang, Guido Musso, Alessandro F. Rotta Loria   +3 more
wiley   +1 more source