Results 51 to 60 of about 2,141 (211)
Impact of MgO Additions on the Oxidation Resistance and Compression Behavior of Vanadium Alloys
An increase in oxidation resistance at 600 °C is achieved for alloys containing more than 2.5 wt.% MgO. It has been established that, along with V2O5, MgO6V2, and Mg2O7V2 are formed, which are presumed to enhance oxidative stability. Furthermore, the possible transformation of Mg‐vanadates through reaction with CO2, which presumably occurs in this ...
Ievgen Solodkyi +5 more
wiley +1 more source
Long ground resting of coins small denomination might affect their microstructure due to advanced corrosion. It is well known that cleaning of silver-copper alloy artifacts leads to a surface enrichment of the silver amount due to the partial removal of
Nicoleta IGNAT +6 more
doaj +1 more source
Multilayer Self‐Limiting Electrospray Deposition via Stepped Voltage Bias
Self‐limiting electrospray deposition (SLED) uses a high voltage to generate and deposit a charged payload on a target surface. The coating retains its charge, repelling newly arriving material. SLED thickness can be decreased by applying a secondary bias to the target.
Madhuri Deb +3 more
wiley +1 more source
Effect of Thiazole Derivatives on Copper Corrosion in Acidic Sulphate Solution
Inhibition of copper corrosion in 0.1 mol dm-3 Na2SO4 solution (pH 3) by two thiazole derivatives of 5-(5'-methylfurfurylidene-2')-2,4-dioxotetrahydro-1,3-thiazole (MFDT) and 2-thiono-5-(4'-ethoxybenzylidene)-4-oxotetrahydro-1,3-thiazole (TEBOT) was ...
Jelena Nakomčić +3 more
doaj +1 more source
Controlling the Field Assisted Sintering Technology (FAST) parameters, dwell temperature and cooling rate, significantly influences the microstructural evolution in titanium aluminide GE4822. Significant γ‐lamellar colonies develop only upon cooling through the α‐transus.
Jack Krohn, James Pepper, Martin Jackson
wiley +1 more source
Copper recovery improvement by reducing the misreported copper minerals into the tailings of scavenger flotation circuit – Part II [PDF]
Loss of copper minerals in the tailings of the rougher and scavenger circuits poses a significant challenge in copper processing plants, diminishing the circuit's efficiency.
Ataallah Bahrami +5 more
doaj +1 more source
Enhancing Low‐Temperature Performance of Sodium‐Ion Batteries via Anion‐Solvent Interactions
DOL is introduced into electrolytes as a co‐solvent, increasing slat solubility, ion conductivity, and the de‐solvent process, and forming an anion‐rich solvent shell due to its high interaction with anion. With the above virtues, the batteries using this electrolyte exhibit excellent cycling stability at low temperatures. Abstract Sodium‐ion batteries
Cheng Zheng +7 more
wiley +1 more source
This study evaluated and compared the high-frequency transmission characteristics of coplanar transmission lines fabricated on copper-plated cycloolefin polymer (COP) films using two different seed layer formation methods—our proposed direct ...
Akihiro Shimizu +4 more
doaj +1 more source
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone +11 more
wiley +1 more source
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein +4 more
wiley +1 more source

