Results 71 to 80 of about 3,274,429 (296)

Copper and copper alloys : welding, soldering, brazing, surfacing /

, 1972
"This handbook was prepared as Chapter Sixty-eight of the Sixth Edition of Volume Four of the Welding Handbook published by the American Welding Society, Miami, Fla. It was reprinted for the Copper Development Association by the American Welding Society."
Prager, Martin,, Copper Development Association.   +1 more
core  

Copper recovery improvement by reducing the misreported copper minerals into the tailings of scavenger flotation circuit – Part II [PDF]

International Journal of Mining and Geo-Engineering
Loss of copper minerals in the tailings of the rougher and scavenger circuits poses a significant challenge in copper processing plants, diminishing the circuit's efficiency.
Ataallah Bahrami, Fatemeh Kazemi, Mahsa Rahbari, Abolfazl Danesh, Mirsaleh Mirmohammadi, Farhad Azizafshari   +5 more
doaj   +1 more source

FastNano Liquid: An Automated Platform for Small‐Angle X‐ray Scattering‐Based Materials Discovery

Advanced Engineering Materials, EarlyView.
We present FastNano Liquid, an automated small‐ and wide‐angle X‐ray scattering platform for the combined synthesis and characterization of (nano)materials. The platform is coupled to varied reactor workflows for both in situ studies of reaction kinetics and ex situ screening of synthesis conditions to support machine learning‐guided exploration ...
Pierre‐Baptiste Flandrin, Émeline Cournède, Jens Krarup, Michael Lesa, Foyzul Hasan, Amandine Séné, Arnaud Lahouati, David Benhaiem, Jérémie‐Luc Sanchez, Simon Delacroix, Thierry Gacoin, Fabienne Testard, Damien Faivre, David Carriere, Corinne Chevallard, Olivier Taché, Mark A. Levenstein   +16 more
wiley   +1 more source

Copper alloys in marine environments

, 1985
SIGLEAvailable from British Library Lending Division - LD:85/23552(Copper) / BLDSC - British Library Document Supply CentreGBUnited ...
Copper Development Association, Potters Bar (United Kingdom)
core  

Evaluation of the High-Frequency Transmission Characteristics of Coplanar Transmission Lines Fabricated on a Copper-Plated Cycloolefin Polymer Using a Direct Sputtering Copper Seed Layer

IEEE Access
This study evaluated and compared the high-frequency transmission characteristics of coplanar transmission lines fabricated on copper-plated cycloolefin polymer (COP) films using two different seed layer formation methods—our proposed direct ...
Akihiro Shimizu, Kazuhiro Fukada, Mitsunori Abe, Akiko Matsui, Shinichi Endo   +4 more
doaj   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

Worn moly copper balls

, 1944
Different groupings of worn moly copper balls taken from Mill No.
Kennecott Copper Corporation
core  

Enhancing Low‐Temperature Performance of Sodium‐Ion Batteries via Anion‐Solvent Interactions

Advanced Functional Materials, EarlyView.
DOL is introduced into electrolytes as a co‐solvent, increasing slat solubility, ion conductivity, and the de‐solvent process, and forming an anion‐rich solvent shell due to its high interaction with anion. With the above virtues, the batteries using this electrolyte exhibit excellent cycling stability at low temperatures. Abstract Sodium‐ion batteries
Cheng Zheng, Qian Yao, Yanan Sun, Hongyu Lv, Zhongchao Bai, Guoliang Zhang, Nana Wang, Jian Yang   +7 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Study on AC Loss of REBCO Tape Encapsulated with Magnetic Materials

Crystals
REBCO coated conductors have a multi-layer structure, and the outer encapsulation layer is generally made of non-magnetic copper material. This paper proposes a new structure of REBCO tape, which replaces the copper layer with magnetic material to ...
Wei Chen, Rong Jin, Yang Bai, Fei Chi, Jiaqing Xu, Xinsheng Yang, Yunpeng Zhu   +6 more
doaj   +1 more source