Results 131 to 140 of about 128,726 (233)

Toward Pore‐Engineered 3D‐Printed Materials for Sorption Water Harvesting, Interfacial Evaporation, and Radiative Cooling

Advanced Materials, EarlyView.
Water harvesting, radiative cooling, and interfacial solar evaporation are fundamentally governed by coupled heat, mass, and light transport processes. These processes are mediated by pore architecture, including pore size, connectivity, and hierarchical organization.
Dejan J. Trajkovski, Higgins M. Wilson, Abdallah Y. M. Ali, Jiaxing Xu, Ruzhu Wang, Primož Poredoš   +5 more
wiley   +1 more source

Photocatalytic Water Splitting on the Lunar Surface: Prospects for In Situ Resource Utilization

Advanced Materials Interfaces, EarlyView.
Water has been found in craters on the moon nearby locations which are illuminated >80% of the time. Photocatalysis uses energy from sunlight to drive chemical reactions such as water splitting to produce oxygen and hydrogen. It is a scalable technology that requires lighter equipment and utilizes resources available on the moon. ABSTRACT The discovery
Ranjani Kalyan, Thomas D. Small, Gregory F. Metha, Mahmoud Adel Hamza, Thomas J. O'Dea, Yideng Shen, Cameron J. Shearer   +6 more
wiley   +1 more source

Understanding Operando Water Management in Hydroxide‐Exchange‐Membrane Fuel Cells

Advanced Materials Interfaces, EarlyView.
Effective water management is vital for high‐performance hydroxide‐exchange‐membrane fuel cells. Using a custom water‐flux station, this study quantifies how membrane thickness, microporous layers, and operating conditions dictate internal water transport.
Catherine M. Weiss, Shiyi Wang, Brian P. Setzler, Yushan Yan, Adam Z. Weber   +4 more
wiley   +1 more source

Effect of Zr Content on the Microstructure and Corrosion Behavior of 1235D Aluminum Alloy. [PDF]

Materials (Basel)
Li J, Liu Y, Li S, Zhao E.
europepmc   +1 more source

Spike‐Type Band Alignment via in2Se3/CuI Charge‐Transport Engineering Enables 26% Efficient Lead‐Free RbSn0.5Ge0.5I3 Perovskite Solar Cells

Advanced Materials Interfaces, EarlyView.
A lead‐free and Cd‐free RbSn₀.5Ge₀.5I3 perovskite solar cell is optimized through In2Se3/CuI charge‐transport engineering using SCAPS‐1D. Spike‐type band alignment suppresses interfacial recombination, enhances charge extraction, and achieves a power conversion efficiency of 26.01%, providing an effective strategy for high‐performance and ...
Md. Al Amin, Md. Sanwar Hossain, Md. Feroz Ali, Md Shafiul Alam, Mohammad Ali, Mohammed A. AlAqil   +5 more
wiley   +1 more source

Corrosion Behavior of a Monolithic Zr-Cu-Al-Ag Bulk Metallic Glass and a Zr-Cu-Al-Ag Bulk Metallic Glass Matrix Composite in Sodium Chloride Medium. [PDF]

Materials (Basel)
Lyu MD, Wang HS, Hsieh CC, Wu MH, Jang JS.   +4 more
europepmc   +1 more source

Surface Segregation in Compositionally Complex Ag‐Au‐Pd‐Pt Solid Solutions: Insights From High‐Throughput Experimentation and Atomistic Simulations

Advanced Materials Interfaces, EarlyView.
Surface segregation in quaternary Ag‐Au‐Pd‐Pt compositionally complex solid solutions is systematically mapped across 684 compositions by combining high‐throughput EDX and XPS characterization of co‐sputtered thin‐film libraries with large‐scale MD/MC atomistic simulations.
Ridha Zerdoumi, Felix Thelen, Quentin Bizot, Aleksander Kostka, Rico Zehl, Florian Lourens, Yanyan Liang, Matous Mrovec, Ralf Drautz, Wolfgang Schuhmann, Alfred Ludwig   +10 more
wiley   +1 more source

Corrosión

La corrosión es un fenómeno espontáneo que se presenta prácticamente en todos los materiales procesados por el hombre. Si bien existen varias definiciones, es común describir la corrosión como una oxidación acelerada y continua que desgasta, deteriora y ...
Ortiz H., Pablo, Cortés M., María Teresa   +1 more
core   +1 more source

Sonochemical technologies in corrosion science and engineering: from laboratory studies to industrial perspectives. [PDF]

Ultrason Sonochem
Verma C, Pathania AR, AlFantazi A.
europepmc   +1 more source

Recent Advances in Plasma‐Enhanced Atomic Layer Etching for Next‐Generation Nanofabrication

Advanced Materials Interfaces, EarlyView.
Continued semiconductor miniaturization demands atomic‐scale patterning and ultralow surface roughness beyond the capabilities of conventional reactive ion etching. This review highlights advances in isotropic and anisotropic plasma‐enhanced atomic layer etching since 2020, covering fundamental mechanisms, applications across major semiconductor ...
Shih‐Nan Hsiao
wiley   +1 more source