Results 251 to 260 of about 638,978 (319)
Bending Fatigue Evaluation and Failure Modes of Ultra‐Thin Silicon Chips on Flexible Substrates
This study investigates the fatigue lifetime of 20‐μm‐thick chips under bending deformation. Three failure modes are identified: metal pad wearing, metal stress migration, and gold wire break. The underlying mechanisms are analyzed through micro‐scale characterization, and temperature effects on fatigue lifetime are explored.
Ying Chen +7 more
wiley +1 more source
Microstructural Damage Evolution and Interfacial Failure Mechanism of NC-UHPC Composites Under Seawater Wet-Dry Cycling. [PDF]
Wei Z +5 more
europepmc +1 more source
Alkali-Activated Polymers for Grouting: A Review of Mechanisms, Performance, and Engineering Applications. [PDF]
Liu B, Xu M.
europepmc +1 more source
Study on Erosion Patterns of Cyclone Desanders at Shale Gas Wellheads. [PDF]
Huang Q +9 more
europepmc +1 more source
From the Problem of Corrosion to Green Solutions: The Role of Biosurfactants as Anti-Corrosion Agents. [PDF]
Oliveira KW +5 more
europepmc +1 more source

