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Bending Fatigue Evaluation and Failure Modes of Ultra‐Thin Silicon Chips on Flexible Substrates

open access: yesFlexTech, EarlyView.
This study investigates the fatigue lifetime of 20‐μm‐thick chips under bending deformation. Three failure modes are identified: metal pad wearing, metal stress migration, and gold wire break. The underlying mechanisms are analyzed through micro‐scale characterization, and temperature effects on fatigue lifetime are explored.
Ying Chen   +7 more
wiley   +1 more source

Study on Erosion Patterns of Cyclone Desanders at Shale Gas Wellheads. [PDF]

open access: yesMaterials (Basel)
Huang Q   +9 more
europepmc   +1 more source

From the Problem of Corrosion to Green Solutions: The Role of Biosurfactants as Anti-Corrosion Agents. [PDF]

open access: yesMaterials (Basel)
Oliveira KW   +5 more
europepmc   +1 more source

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