Topological mechanical metamaterial for robust and ductile one-way fracturing. [PDF]
Wang X, Sarkar S, Gonella S, Mao X.
europepmc +1 more source
Identified through the use of statistical design of experiments and metallographic investigation, this study exposes the stochastic origins of intergranular cracks in blown powder laser beam directed energy deposition additive manufacturing of pure molybdenum. It further demonstrates a successful crack mitigation approach with direct correlation to the
Nathaniel J. Lies +2 more
wiley +1 more source
AE-based classification and fracture process analysis of flawed marble with stress intensity factor validation. [PDF]
Sha P, Fan J, Lv Y, Chen J.
europepmc +1 more source
Numerical Exploration of Thermal Shock Resistance in MgO–C Refractories
A mesostructure‐resolved numerical framework is developed to evaluate the thermal shock resistance of MgO–C refractories. By modeling interface debonding under rapid temperature changes and introducing a modified thermal shock parameter that accounts for mesocracks, the study shows how graphite content and aggregate size influence thermal shock ...
Jishnu Vinayak Gopi +3 more
wiley +1 more source
Determination of mechanical properties of ceramic microspheres using an improved flat-plate crushing test and global cohesive zone modeling. [PDF]
Ma H +5 more
europepmc +1 more source
Microstructure Evolution of a VMnFeCoNi High‐Entropy Alloy After Synthesis, Swaging, and Annealing
The synthesis and processing (rotary swaging and annealing) of the novel VMnFeCoNi alloy is investigated, alongside the estimation of the grain size effect on hardness. Analysis of a wide grain size range of recrystallized microstructures (12–210 µm) reveals a low annealing twin density.
Aditya Srinivasan Tirunilai +6 more
wiley +1 more source
Analysis of Post-Bonding Crack-Induced Double Cantilever Bending (PDC-DCB) Method for Hybrid Bonding Strength Measurement. [PDF]
Mei C +9 more
europepmc +1 more source
Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source
Signatures of the sub-Rayleigh to supershear fracture transition in snow avalanche experiments. [PDF]
Bergfeld B +5 more
europepmc +1 more source
Photoswitchable Conductive Metal–Organic Frameworks
A conductive material where the conductivity can be modulated remotely by irradiation with light is presented. It is based on films of conductive metal–organic framework type Cu3(HHTP)2 with embedded photochromic molecules such as azobenzene, diarylethene, spiropyran, and hexaarylbiimidazole in the pores.
Yidong Liu +5 more
wiley +1 more source

