The effect of different borehole spacing and detonation time difference on crack propagation in double-hole shaped charge blasting. [PDF]
Xu S, Wu B, Dou Z.
europepmc +1 more source
Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding. [PDF]
Zheng T +10 more
europepmc +1 more source
Investigating the Cracking Processes and Bearing Performance of Fissured Concrete SCB Specimens via DEM-Based Mesoscopic Modeling Considering Fissure Angle, Aggregate Content and Porosity. [PDF]
Li Q +6 more
europepmc +1 more source
Effect of Deposit Chemistry on the Stress Corrosion Cracking Susceptibility of CMSX-10 at 550°C and 700°C. [PDF]
Martinez FD +6 more
europepmc +1 more source
Acoustic emission characteristics and failure precursors under uniaxial cyclic compression. [PDF]
Zhang Y, Mei F.
europepmc +1 more source
Related searches:
Dynamic steady-state crack propagation in quasi-crystals
Mathematical Methods in the Applied Sciences, 2010Summary: The steady propagation of planar cracks in quasi-crystalline bodies with velocity lower than the one of bulk elastic macroscopic waves is under scrutiny. Closed-form solutions to the balance laws are provided. Unusual Mach number limits are determined. Numerical experiments describing peculiar aspects of the crack propagation in quasi-crystals
Enrico Radi, Paolo Maria Mariano
openaire +4 more sources
Crack front elastic stress state for three-dimensional crack problems
International Journal of Fracture, 1984The problems inherent in the estimation of fracture mechanics parameters for three-dimensional crack problems are reviewed. A novel parameter is introduced to quantify the loss of constraint along that portion of a crack front adjacent to a free surface.
D. N. Fenner, M. J. Abdul Mihsein
openaire +1 more source
Early-state crack detection method for heel-cracks in wire bond interconnects
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014Reliability of electronic systems is finally limited due to thermo-mechanical fatigue of interconnections. Besides soldered interconnections wire bonding is one of the most commonly used interconnection technology in electronics. Due to thermo-mechanical loading wire bond technology suffers from cracking in the heel region and delamination in the ...
Krüger, Michael +4 more
openaire +1 more source
Stratified Energies: Ground States with Cracks
2009Elastic bodies admitting cracks are analyzed. Separated pairs of displacement fields and cracks are found as minimizers of the energy in large strain setting. The crack patterns are constructed in terms of varifolds. The discontinuity set of the displacement field is contained in the cracks and may or may not coincide with them.
Mariano Giaquinta +3 more
openaire +3 more sources

