Results 101 to 110 of about 8,285 (310)

Ultrathin Li Metal Anodes: Quantitative Design Principles and Manufacturability Across Liquid and Solid‐State Batteries

open access: yesAdvanced Materials, EarlyView.
Ultrathin lithium metal anodes (≤15 µm) offer a promising route to high‐energy‐density batteries due to their high capacity and low potential. This review presents design principles for ultrathin Li, evaluates fabrication strategies, and discusses challenges in liquid and solid‐state cells.
Cheng Wang   +9 more
wiley   +1 more source

Evaluation of creep properties of steel P92 and its welded joint

open access: yesMetalurgija, 2014
This work is focused on testing and evaluation of creep properties of P92 base material (BM) and welded joints (WJ) as well. Up to date results of creep rupture test of P92 base metal and welds are presented in this article.
P. Mohyla   +3 more
doaj  

Influence of grain size and niobium content on the creep resistance of ferritic stainless steels

open access: yes, 2008
Includes abstract.Includes bibliographical references (leaves 98-102).Type 441 ferritic stainless steel is used for the production of catalytic converter housings.
Cain, Victoria
core  

Super‐Resolution Ultrasound Based Cell Tracking With Polymeric Nanobubbles

open access: yesAdvanced Materials, EarlyView.
This study presents a super‐resolution ultrasound platform for tracking cells in vivo. Biocompatible polymeric nanobubbles are used as highly echogenic intracellular labels. Following the injection of cells and microbubbles, ultrasound localization microscopy (ULM) can dynamically match the microvascular architecture and individual cell trajectories ...
Junlin Chen   +19 more
wiley   +1 more source

Predicting creep rupture from early strain data

open access: yes, 2009
To extend creep life modelling from classical rupture modelling, a robust and effective parametric strain model has been developed. The model can reproduce with good accuracy all parts of the creep curve, economically utilising the available rupture ...
Auerkari, Pertti, Holmström, Stefan
core   +1 more source

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane   +4 more
wiley   +1 more source

Modelling of Creep Rupture in Clay using the Bounding Surface Viscoplasticity Theory

open access: yesJournal of Materials and Engineering Structures, 2020
The creep process is generally defined into three stages: primary, secondary and tertiary creep. Tertiary creep is the last phase among the three phases of creep process, where the strain rate accelerates until creep rupture occurs. This paper presents a
Thi Ngoc MAC   +2 more
doaj  

The Development and Validation of the Creep Damage Constitutive Equations for P91 Alloy

open access: yes
This paper presents research on the validation of a set of creep damage constitutive equations for P91 alloy under multi-axial states of stress, and its applicability under lower stress level.
Yang, Xin, Xu, Qiang, Lu, Zhongyu
core  

Consistent creep and rupture properties for creep-fatigue evaluation

open access: yes, 1978
The currently accepted practice of using inconsistent representations of creep and rupture behaviors in the prediction of creep-fatigue life is shown to introduce a factor of safety beyond that specified in current ASME Code design rules for 304 ...
Schultz, C.C., C. C. Schultz
core   +1 more source

Self‐Soldering, Stretchable and Self‐Healing Liquid Metal Elastomer Interconnections for Soft Electronics Platforms

open access: yesAdvanced Materials Technologies, EarlyView.
A self‐healing and electrically conductive liquid metal elastomer enables robust self‐soldering of surface mount devices for soft electronics. Photothermally activated conductive pathways, strong pressure‐sensitive adhesion, and stable package‐integrated contacts provide high conductivity and extreme stretchability.
Su Thiri San   +5 more
wiley   +1 more source

Home - About - Disclaimer - Privacy