Results 191 to 200 of about 84,623 (347)
CALCULATION OF CRITICAL BUCKLING LOAD OF PILE UNDER LIQUEFIED SOIL CONDITIONS
Xiaoyu Zhang, Liang Tang, Xianzhang Ling
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Towards a Probabilistic Preliminary Design Criterion for Buckling Critical Composite Shells [PDF]
J. Arbocz, Mark W. Hilburger
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Vacuum–Laser Fabrication of Programmable Soft Actuators
A rapid and accessible fabrication strategy for inflatable soft actuators is presented, combining vacuum sealing with laser cutting of low‐cost thermoplastic pouches. The method enables precise sealing, fast fabrication, and programmable multi‐cell geometries.
Ashkan Rezanejad +5 more
wiley +1 more source
Comparative Study Concerning the Methods of Calculation of the Critical Axial Buckling Load for Stiffened Cylindrical Shells [PDF]
Maria Zaharia +2 more
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A Janus‐like bio‐inspired strategy is proposed for integrally 3D‐printed bimetallic metamaterials. Inspired by shell bilayers, a heat‐resistant AlSiFeMnNiMg alloy and a SiC‐reinforced AlSi10Mg with different SiC volume fractions are arranged as an architected pair.
Zhicheng Dong +5 more
wiley +1 more source
Pellet Printing for Soft Robotic Devices
Fused Granulate Fabrication (FGF) is established here as a reliable method for fabricating soft, airtight robotic devices. Through coordinated optimization of hardware, material selection, and process parameters, this approach enables high‐speed printing of thermoplastic elastomers with silicone‐like softness and modulus.
Yijia Wu +6 more
wiley +1 more source
Critical Buckling Load Analysis of Layered Functionally Graded Shell Structures
Savaş Evran
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Bio‐templated Piezoresistive Yarn for High Sensitivity Movement Monitoring Textiles
This study developed a conductive coating by biotemplating silver nanoparticles (AgNPs) onto a Potato virus A (PV) particle network, cross‐linked on co‐polyamide‐starch (CoPA‐SS) coils. The combination of CoPA‐SS's shape memory and PV‐AgNP's piezoresistivity achieved high strain sensitivity and minimal hysteresis.
Swarnalok De +10 more
wiley +1 more source
Fabrication of High‐Density Multimodal Neural Probes Based on Heterogeneously Integrated CMOS
A chiplet‐based methodology democratizes active neural probe development on standard bulk CMOS services. This yields the first probe combining high‐density electrophysiology (416 electrodes) with calcium imaging (832 photodiodes) and complete on‐chip signal processing across 13 shanks.
Ju Hee Mun +10 more
wiley +1 more source

