Results 271 to 280 of about 44,319 (379)

Performance and Meat Quality of Three-Crossbreed Korean Native Chickens (KNC) [PDF]

open access: bronze, 2011
Mina Park   +4 more
openalex   +1 more source

Photoswitchable Conductive Metal–Organic Frameworks

open access: yesAdvanced Functional Materials, EarlyView.
A conductive material where the conductivity can be modulated remotely by irradiation with light is presented. It is based on films of conductive metal–organic framework type Cu3(HHTP)2 with embedded photochromic molecules such as azobenzene, diarylethene, spiropyran, and hexaarylbiimidazole in the pores.
Yidong Liu   +5 more
wiley   +1 more source

Genome wide locus-specific ancestry analysis revealed adaptive admixtures in crossbred cattle of India. [PDF]

open access: yesSci Rep
Goli RC   +16 more
europepmc   +1 more source

Effects of crossbreeding on slaughter traits and breast muscle chemical composition in chinese chickens [PDF]

open access: gold, 2011
A. Huang   +11 more
openalex   +1 more source

Ideal Molecular Sieving with a Dense MOF for Helium Upgrading with Highly Diffusion Selective Mixed Matrix Membranes

open access: yesAdvanced Functional Materials, EarlyView.
The separation of Helium gas from natural gas is challenging but highly important. MIL‐116(Ga), a “non‐porous” metal–organic framework is used as a molecular sieve to separate He from CH4. Druse‐like MIL‐116(Ga) particles are integrated into polysulfone mixed matrix membranes.
Ayisha Komal   +10 more
wiley   +1 more source

The genetic structure and diversity of smallholder dairy cattle in Rwanda. [PDF]

open access: yesBMC Genom Data
Opoola O   +9 more
europepmc   +1 more source

Carbon Nanotube 3D Integrated Circuits: From Design to Applications

open access: yesAdvanced Functional Materials, EarlyView.
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu   +3 more
wiley   +1 more source

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