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Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding

Journal of the Taiwan Institute of Chemical Engineers, 2022
Abstract Background Cu-Cu direct bonding is a promising technology to construct a temperature resistant bonding structure for emerging power devices and vehicle electronics. The main challenge is the ease oxidation of Cu and slow solid-state atomic diffusion at the bonding surface.
Jhih-Jhu Jhan   +3 more
openaire   +1 more source

An Energetic CuS–Cu Battery System Based on CuS Nanosheet Arrays

ACS Nano, 2021
The development of low-cost and high-energy aqueous battery technologies is of significance for renewable and stationary energy applications. However, this development has been bottlenecked by poor conductivity, low capacity, and limited cycling stability of existing electrode materials. In this work, we report on an energetic aqueous copper ion system
Yichun Wang   +4 more
openaire   +2 more sources

Diffusion of Cu on Cu surfaces

Physical Review B, 1995
Diffusion of a single Cu adatom on low-index Cu surfaces with different morphologies (with and without the presence of other Cu adatoms as well as near and over stepped surfaces) is studied using the embedded-atom method and a molecular static simulation.
, Karimi, , Tomkowski, , Vidali, , Biham
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Derivatives (Cu/CuO, Cu/Cu2O, and CuS) of Cu superstructures reduced by biomass reductants

Materials Today Chemistry, 2021
Abstract Metallic Cu is considered as the promising functional material owing to its high conductivity and harmlessness. Here, metallic Cu which presents a unique interconnected and continuous structure (Cu superstructure) is prepared using Magnolia grandiflora leaves as the biomass reductant, a green process which avoided the release of harmful ...
Meijuan Yuan, Xiaotian Guo, Huan Pang
openaire   +1 more source

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