Results 261 to 270 of about 1,113,963 (297)

Spectra and energy levels of Cu xxii, Cu xxiii, Cu xxiv, and Cu xxv

Journal of the Optical Society of America B, 1987
Transitions in highly ionized copper in the wavelength range 65-121 A have been identified in spectra recorded at the University of Rochester's 24-beam Omega laser facility. Wavelengths and energy levels are presented for oxygenlike Cu XXII, nitrogenlike Cu XXII, carbonlike Cu XXIV, and boronlike Cu XXV.
J. O. Ekberg, M. C. Richardson, W. E. Behring, J. F. Seely, C. M. Brown, U. Feldman   +5 more
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Thermodynamic investigations of Cu-Dy, Cu-Er, Cu-Gd and Cu-La alloys

Journal of the Less Common Metals, 1986
Abstract The heats of formation of intermetallic compounds of copper with dysprosium, erbium, gadolinium and lanthanum have been determined by solution calorimetry in liquid tin at 1100 K. The enthalpy of mixing of the liquid alloys is obtained measuring additionally enthalpy of melting of the compounds.
Ferdinand Sommer, Joachim Schott, Bruno Predel   +2 more
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Investigation of the H–Cu and Cu–Cu bonds in hydrogenated Cu

Journal of Physics and Chemistry of Solids, 2013
Abstract The pure and hydrogenated copper system CuH n ( n =0, 0.25, 0.50, 0.75 and 1) has been investigated using LCAO-DFT. The average H–Cu (Cu–Cu) bonding interaction increases (decreases) with n whilst concurrent orbital-resolved studies of the H–Cu interactions showed that the (non-)directional H–Cu bonds become more (less) bonding.
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Texture and resistivity of dilute binary Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy thin films

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 2002
Annealing of dilute Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy films resulted in the lowest resistivity for Cu(Ti) and Cu(In) and the strongest 〈111〉 fiber texture also for Cu(Ti). Electron-beam evaporated films with compositions in the range of 2.0–4.2 at. % and thicknesses in the range of 420–560 nm were annealed at 400 °C for 5 h.
A. Gungor, K. Barmak, A. D. Rollett, C. Cabral, J. M. E. Harper   +4 more
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Self aligned passivation of Cu in Cu/Cr, Cu/V and Cu/Ta multilayers

ICM 2000. Proceedings of the 12th International Conference on Microelectronics. (IEEE Cat. No.00EX453), 2002
We compare Cu/M/SiO/sub 2/ (M=Cr,V and Ta) multilayers that were deposited on Si substrates. Sample resistance measurements were carried out during annealing in 80% N/sub 2/+20% H/sub 2/, N/sub 2/ and Ar environments. Resistivity measurements, SEM observations, RBS and AES spectroscopies from annealed samples showed good diffusion barrier properties ...
A. Iraji-zad, Z. Vashaei, S.M. Mahdavi
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Activity of oxygen in Cu-Au, Cu-Ag, Cu-Pt, Cu-Ni, Cu-Co and Cu-Fe alloys

Canadian Metallurgical Quarterly, 1970
AbstractThermodynamic properties of dilute solutions of oxygen in liquid Cu-Au, Cu-Ag, Cu-Pt, Cu-Ni, Cu-Co and Cu-Fe alloys have been studied by means of the hydrogen water vapour equilibrium. The following reactionH2(g)+[O]soln = H2O(g)was studied for which an equilibrium ratio can be written: K = PH2O/ PH2 [at.
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Effects of Cu status and Cu intake on retention of exogenous Cu in the rat

Journal of Comparative Pathology, 1973
Abstract Whole body retention in Hooded Lister rats of various doses of Cu given intraperitoneally were measured. Single doses of Cu ranging from 0·01 to 0·8 mg. Cu were given to rats receiving diets containing 1 and 21 parts/million Cu for 3 weeks before dosing and thereafter. Doses of 0·6 and 0·8 mg. produced toxic symptoms and some deaths.
B S, Smith, A C, Field
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Cu-Cu Bonding with Cu Nanowire Arrays for Electronics Integration

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020
Due to the demand of miniaturization and high reliability, heterogeneous integration of wide band gap semiconductors requires advanced interconnect materials that enable optimum designs of component and hierarchical architectural dispositions. Although traditional Cu-Cu thermocompression bonding is considered as a front-runner compared to solder-based ...
Han Jiang, Stuart Robertson, Zhaoxia Zhou, Changqing Liu   +3 more
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Growth of Cu on Cu(100)

Surface Science, 1992
Helium atom beam scattering has been used to study the growth of Cu on Cu(100). Temporal diffraction peak oscillations are observed for temperatures as low as 100 K.
H.-J. Ernst, F. Fabre, J. Lapujoulade
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Cu to Cu bonding with Cu@Ag core-shell nanoparticles

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012
In this study, PVP-protected Cu@Ag core-shell nanoparticles with different Ag shell thicknesses were synthesized and applied to Cu to Cu bonding. The phase transformation of Cu@Ag core-shell nanoparticles (about 80 nm in average particle diameter and 10 nm in shell thickness) upon heating in air was investigated via in situ synchrotron radiation X-ray ...
Jenn-Ming Song, Chih-Hsun Chang, Jia-Shin Wu, Chih-Hang Tsai, Shih-Yun Chen   +4 more
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