Results 221 to 230 of about 506,489 (355)

The Vegan Villain Sets Out to The End of Summer: Functionalized Coatings as Biohybrid UV‐Sensors

open access: yesAdvanced Materials Interfaces, EarlyView.
This study introduces biohybrid coatings incorporating E. coli biomass expressing photoconvertible fluorescent proteins as UV‐A responsive elements. Upon irradiation at 400 nm, the coatings exhibit an irreversible fluorescence shift from green to red within 15 min. Notably, the photoconversion capability is retained after >1 year of storage.
Amelie Skopp   +3 more
wiley   +1 more source

Piezoelectric Stimulation of Neural Cells: Exploring the Synergistic Potential of Hybrid Scaffolds for Enhanced Regeneration

open access: yesAdvanced Materials Interfaces, EarlyView.
Hybrid piezoelectric scaffolds offer a promising route for Central Nervous System regeneration by combining structural and electrical cues to support neural stem cell growth. This review highlights their potential to overcome current challenges in neural tissue engineering by exploring porous hybrid materials, their biological interactions, and ...
Heather F. Titterton   +2 more
wiley   +1 more source

Interface‐Engineered Graphene‐Coated Titanium Dioxide Nanoparticles for High‐Performance Grease Lubrication

open access: yesAdvanced Materials Interfaces, EarlyView.
Graphene‐coated TiO2 core–shell nanoparticles are introduced as multifunctional additives for lithium grease, yielding an 85.7% reduction in wear rate, a 22% decrease in operating temperature, and improved film retention under mixed lubrication.
Ethan Stefan‐Henningsen   +1 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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