Results 101 to 110 of about 366,258 (347)
Al‐Cu intermetallic compounds (IMCs) have a significant influence on the properties of Al‐Cu bimetallic interfaces formed in compound casting. This article provides a deeper understanding of microstructure, crystallography, thermal properties, hardness, and corrosion response of Al‐Cu IMCs with the goal of facilitating the optimization of the ...
Alireza Nazarahari +7 more
wiley +1 more source
This study presents micropleated filters manufactured by needleless electrospinning. Nanofibers are deposited onto uniaxially pre‐stretched substrates that contract upon release, forming densely packed micropleats. This architecture increases effective surface area without enlarging the filter size, achieving quality factors comparable to those of ...
Aleksandr Fadeev +6 more
wiley +1 more source
ARIA: Additive ReRAM-Based Integrity and Aging Monitoring for ICs
This paper reports an approach for monitoring aging and integrity of CMOS circuits through additively manufactured Resistive Random-Access Memory (ReRAM) based test structures.
Thomas Schultz +3 more
doaj +1 more source
Cr0.9Si0.1 protective coatings are developed to enhance the thermal‐shock and oxidation resistance of Mg2Si0.89(Sn0.1,Sb0.01) thermoelectric (TE) materials. The coating forms a dense and adherent barrier that suppresses oxygen diffusion and mitigates mechanical degradation during cyclic oxidation, demonstrating its potential to improve the long‐term ...
Mikdat Gurtaran +3 more
wiley +1 more source
Design of a Programmable Passive SoC for Biomedical Applications Using RFID ISO 15693/NFC5 Interface
Low power, low cost inductively powered passive biotelemetry system involving fully customized RFID/NFC interface base SoC has gained popularity in the last decades.
Mayukh Bhattacharyya +4 more
doaj +1 more source
Screen‐Printed Flexible Piezoelectric Force Sensor Array with Electromagnetic Interference Shielding
This article introduces a flexible screen‐printed piezoelectric sensor array designed for low‐frequency healthcare applications such as tactile sensing and cardiovascular monitoring. The device integrates interface electronics enabling the simultaneous acquisition of up to 128 signals, along with flexible EMI shielding that significantly reduces noise ...
Joseph Faudou +6 more
wiley +1 more source
Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits [PDF]
J. Stopford +8 more
openalex +2 more sources
High-speed and precision positioning are fundamental requirements for high-acceleration low-load mechanisms in integrated circuit (IC) packaging equipment.
Xin Chen +4 more
doaj +1 more source
Thermoelectric Modules Incorporating MgAgSb and Mg3(Sb,Bi)2 Synthesized Using a Melting Method
A scalable synthesis method for a thermoelectric material of MgAgSb is established. A thermoelectric power module of MgAgSb/Mg3(Sb,Bi)2 is fabricated, showing the conversion efficiency of 7.4% at ΔT = 315 K. The performance is comparable to conventional Bi2Te3 modules when they are operated with an air‐cooled heat exchanger.
Kazuo Nagase +8 more
wiley +1 more source

