Results 121 to 130 of about 127,361 (299)
A materials and device design concept that comprises a self‐assembled ultra‐thin epitaxial ion‐transporting layer, an amorphous oxide overcoat oxygen‐blocking layer, and a partial filament formed during an electroforming step is proposed for low‐current multilevel resistive switching devices.
Ming Xiao+17 more
wiley +1 more source
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger+4 more
wiley +1 more source
Fully Integrated 24-GHz 1TX-2RX Transceiver for Compact FMCW Radar Applications
A fully integrated 24-GHz radar transceiver with one transmitter (TX) and two receivers (RXs) for compact frequency modulated continuous wave (FMCW) radar applications is here presented. The FMCW synthesizer was realized using a fractional-N phase-locked
Goo-Han Ko+4 more
doaj +1 more source
The Eect of Mechanical Loading on the Frequency of an Oscillator Circuit [PDF]
We investigate the effect of mechanical strain on the frequency of an electronic oscillator embedded in an integrated circuit. This analysis is aimed at explaining a 1% inaccuracy in the oscillator frequency under test conditions prescribed by a leading ...
Lapin, V., Lee, W., Ward, J.A.
core
Print‐and‐Plate Architected Electrodes for Electrochemical Transformations Under Flow
Typical flow cell electrodes are composed of stochastic porous carbon, limiting understanding of electrode structure‐performance relationships. This work describes an approach, termed “print‐and‐plate,” to prepare porous electrodes by direct ink writing followed by conformal metal coating.
Dylan M. Barber+12 more
wiley +1 more source
Harnessing Outer Space for Improved Electrocaloric Cooling
A novel radiative heat sink/source‐integrated electrocaloric (R‐iEC) system combines the electrocaloric (EC) effect with a thermally conductive radiative cooler (TCRC) to address heat dissipation limitations in EC devices. Utilizing outer space as a heat sink, the system achieves up to 240 W m−2 of heat dissipation performance, making it highly ...
Dong Hyun Seo+8 more
wiley +1 more source
High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits [PDF]
Xianshu Luo+11 more
openalex +1 more source
This work investigates modifying interfacial contacts in realizing giant‐performance semiconductor nanomembrane optoelectronics. Strategies, including surface reaction and buffer layer work‐function modulation, are explored to boost the Schottky barrier. An emerging material of YbOx is utilized for near‐ideal Ohmic contact.
Yibo Zhang+5 more
wiley +1 more source
This paper introduces a flexible neural probe with integrated micro‐OLEDs on a flexible substrate for the first time, featuring 8 micro‐OLEDs and recording electrodes for optogenetics. It uses advanced encapsulation and an IAI anode for durability, emitting 470 nm light for ChR2 activation, enabling high‐resolution, minimally invasive stimulation ...
Somin Lee+8 more
wiley +1 more source
Bi‐directionally assembled BN µ‐platelets in micropatterns formed by a micro‐molding method for thermal interface materials are demonstrated. The BN µ‐platelets are vertically aligned selectively, while compressed regions without patterns accommodate horizontally assembled BN µ‐platelets. Through anisotropic orientation, high thermal conductivities for
Young Gil Kim+12 more
wiley +1 more source