Results 311 to 319 of about 135,759 (319)

Die-Level Thermal Modeling of a Silicon Germanium (Sige) Bicmos Radio Frequency Integrated Circuit (Rfic) for Wireless Communications

2021
openaire   +1 more source

Applying the Grey prediction model to the global integrated circuit industry

Technological Forecasting and Social Change, 2003
exaly  

Design of plastic package die with multi-injection head for integrated circuit

, 2007
Jian Ye
openalex  

Integrated circuit yield statistics

Proceedings of the IEEE, 1983
exaly  

Experimental evaluation of incorporating digital and analog integrated circuit die on a common substrate utilizing silicon-hybrid wafer-scale integration technology

, 1992
Philip C. Reamy
openalex  

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures

Journal of Hazardous Materials, 2007
exaly  

Circuit Design Method for Reducing Static Current Consumption and Integrated Circuit Die Self-Heating in High-Temperature Transimpedance and Operational Amplifiers Based on Field-Effect Transistors

2024 International Conference on Actual Problems of Electron Devices Engineering (APEDE)
Anna V. Bugakova, Ilya V. Frolov, Dmitriy V. Kleimenkin, Nikolay N. Prokopenko   +3 more
openaire   +1 more source

Space product assurance. Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)

2015
openaire   +1 more source

Integrated modeling of chemical mechanical planarization/polishing (CMP) for integrated circuit fabrication: From particle scale to die and wafer scales

, 2003
Jianfeng Luo
openalex