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Die-to-Die Bonding Development Employing Atomic Layer Deposition to Enable Heterogeneous Integration of Optoelectronic Integrated Circuits

2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Yi Xuan Yeo   +5 more
openaire   +1 more source

Fully integrated quantum photonic circuit with an electrically driven light source

Nature Photonics, 2016
Felix Pyatkov   +2 more
exaly  

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