Results 281 to 290 of about 135,759 (319)
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Journal of Micromechanics and Microengineering, 2020
Among the advanced integrated circuit (IC) integration methods, three-dimensional heterogeneous integration with through-silicon via (TSV) technology showed great potential towards the system-level integration with an increased interconnect density in a smaller footprint. However, the heat mitigation across several dies remains a critical issue in this
Hemanth Kumar Cheemalamarri +3 more
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Among the advanced integrated circuit (IC) integration methods, three-dimensional heterogeneous integration with through-silicon via (TSV) technology showed great potential towards the system-level integration with an increased interconnect density in a smaller footprint. However, the heat mitigation across several dies remains a critical issue in this
Hemanth Kumar Cheemalamarri +3 more
openaire +2 more sources
Deep learning techniques for integrated circuit die performance prediction
MRS Advances, 2022Alexander Kovalenko +2 more
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Metrology, Inspection, and Process Control for Microlithography XXXIII, 2019
Device miniaturization and complication is now stimulating the strong needs for the three dimensional (3D) geometry measurement of the structure. Now in the single-nanometer nodes, the CDs need to be known at multiple pattern heights especially in after-etch inspection. This means SEM measurements is expected to provide 3D contours.
Makoto Suzuki, Ayumi Doi
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Device miniaturization and complication is now stimulating the strong needs for the three dimensional (3D) geometry measurement of the structure. Now in the single-nanometer nodes, the CDs need to be known at multiple pattern heights especially in after-etch inspection. This means SEM measurements is expected to provide 3D contours.
Makoto Suzuki, Ayumi Doi
openaire +1 more source
IFAC Proceedings Volumes, 1965
Abstract Die standig fortschreitende Entwicklung der verschiedenen Formen integrierter Schaltungen wird einem Evolutionsgedanken unterzuordnen versucht. Ausgehend von dem sich als auserst fruchtbar erweisenden Konzept, die Drucktechnik zur Realisierung elektrischer Schaltungen zu verwenden, wird man systematisch von der kupfer-kaschierten Platine bis
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Abstract Die standig fortschreitende Entwicklung der verschiedenen Formen integrierter Schaltungen wird einem Evolutionsgedanken unterzuordnen versucht. Ausgehend von dem sich als auserst fruchtbar erweisenden Konzept, die Drucktechnik zur Realisierung elektrischer Schaltungen zu verwenden, wird man systematisch von der kupfer-kaschierten Platine bis
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4598308 Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
Microelectronics Reliability, 1987ChristopherD James, Norman McNeal
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High performance integrated photonic circuit based on inverse design method
Opto-Electronic Advances, 2022Xiaoyong Hu
exaly
, 1972 Photonic-circuit-integrated titanium:sapphire laser
Nature Photonics, 2023Jorge Holguin, Hong X Tang, Yubo Wang
exaly