Results 271 to 280 of about 135,759 (319)
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A die-on-board PCB for testing high-speed integrated circuits
2015 IEEE Applied Electromagnetics Conference (AEMC), 2015Chip-on-board (COB) printed circuit boards (PCB) appear to be a very attractive solution for testing high-speed integrated circuits (IC). Attaching the bare die directly on a PCB takes away the packaging cost, which is as high as the chip fabrication cost or more when it comes to the high-speed ICs. Wafer probing is a good alternative, but may not come
Mukul Ratwani +3 more
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2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), 2018
In this paper, installation automatic die bonding machine and optimization parameters were studied in die attach process for integrated circuit (IC) packaging. Die attach process is one that is very important IC packaging manufacturing. This process is attaching a die or chip take to leadframe or substrate using die bonding machine.
Tanatpol Nanthavittayaporn +3 more
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In this paper, installation automatic die bonding machine and optimization parameters were studied in die attach process for integrated circuit (IC) packaging. Die attach process is one that is very important IC packaging manufacturing. This process is attaching a die or chip take to leadframe or substrate using die bonding machine.
Tanatpol Nanthavittayaporn +3 more
openaire +1 more source
Horizontal die cracking as a yield and reliability problem in integrated circuit devices
Microelectronics Reliability, 1989 openaire +2 more sources
The reliability of Epoxy as a die-attach in digital and linear integrated circuits
Microelectronics Reliability, 1975 openaire +2 more sources
"The Reliability of Epoxy as a Die Attach in Digital and Linear Integrated Circuits"
12th International Reliability Physics Symposium, 1974The implementation and advantages of epoxy die-attach are described with special emphasis given to areas of mechanical integrity and product stability. A recent special test program indicates that the epoxy die-attach process results in reliable product.
Bernard M. Pietrucha, Eugene M. Reiss
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Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), 2004
Delamination at the interface between a silicon backside and the die attach paste has been reported, and this delamination led to package cracking, resulting in reliability problems. In this paper, a series of experiments was conducted to investigate factors affecting the interfacial adhesion between the die back side and the attach paste of an ...
E. Low, G.H. Lim, A.C. Tan
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Delamination at the interface between a silicon backside and the die attach paste has been reported, and this delamination led to package cracking, resulting in reliability problems. In this paper, a series of experiments was conducted to investigate factors affecting the interfacial adhesion between the die back side and the attach paste of an ...
E. Low, G.H. Lim, A.C. Tan
openaire +1 more source
38th Electronics Components Conference 1988., Proceedings., 2003
A photodefinable polyimide based on 3,3',4,4'-benzophenone tetracarboxylic dianhydride, oxydianiline, and metaphenylene-diamine (BTDA-ODA-MPD) was studied for its application as a stress buffer film over the passivation in a plastic-encapsulated device.
M.M. Khan, T.S. Tarter, H. Fatemi
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A photodefinable polyimide based on 3,3',4,4'-benzophenone tetracarboxylic dianhydride, oxydianiline, and metaphenylene-diamine (BTDA-ODA-MPD) was studied for its application as a stress buffer film over the passivation in a plastic-encapsulated device.
M.M. Khan, T.S. Tarter, H. Fatemi
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20th International Reliability Physics Symposium, 1982
A systematic investigation into the performance of plastic encapsulated integrated circuits during humidity testing has been conducted. A failure mechanism has been identified for devices assembled on copper lead frames and traced to the silver loaded polymer used for attaching the I.C. to the frame. Reliability data are presented for devices assembled
Kenneth E. Manchester +2 more
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A systematic investigation into the performance of plastic encapsulated integrated circuits during humidity testing has been conducted. A failure mechanism has been identified for devices assembled on copper lead frames and traced to the silver loaded polymer used for attaching the I.C. to the frame. Reliability data are presented for devices assembled
Kenneth E. Manchester +2 more
openaire +1 more source
Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade, 2002
The authors present a characterization methodology using per-die test structures to address the need for accurate and reliable product-process models for mixed-signal IC designs. These product-process relationships are critical in generating guardbands and forecasting production yields based on predicted product performance across process variations ...
N. Goel +3 more
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The authors present a characterization methodology using per-die test structures to address the need for accurate and reliable product-process models for mixed-signal IC designs. These product-process relationships are critical in generating guardbands and forecasting production yields based on predicted product performance across process variations ...
N. Goel +3 more
openaire +1 more source