Results 41 to 50 of about 366,258 (347)
The integration of on-line monitoring and reconfiguration functions using IEEE1149.4 into a safety critical automotive electronic control unit. [PDF]
, 2005 This paper presents an innovative application of IEEE 1149.4 and the integrated diagnostic reconfiguration (IDR) as tools for the implementation of an embedded test solution for an automotive electronic control unit, implemented as a fully integrated ...
Cutajar, R. +5 more
core +1 more source
Applied Surface Science Advances, 2020 This paper reports development and performance evaluation of room temperature operated Mercury Cadmium Telluride (HgCdTe) colloidal quantum dot (CQD) coated Si Readout Integrated Circuit (ROIC) based Infrared (IR) Focal Plane Array (FPA).
Abhijit Chatterjee +3 more
doaj +1 more source
mm-Wave Silicon ICs: Challenges and Opportunities [PDF]
, 2007 Millimeter-waves offer promising opportunities and interesting challenges to silicon integrated circuit and system designers. These challenges go beyond standard circuit design questions and span a broader range of topics including wave propagation ...
Hajimiri, Ali
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Wafer-Level Characterization and Monitoring Platform for Single-Photon Avalanche Diodes
IEEE Journal of the Electron Devices SocietyWhen developing a technology based on single-photon avalanche diodes (SPADs), the SPAD characterization is mandatory to debug, optimize and monitor the microfabrication process.
Samuel Parent +11 more
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Micromachines, 2021 Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant.
Seonho Seok
doaj +1 more source
Correlation between pattern density and linewidth variation in silicon photonics waveguides [PDF]
, 2020 We describe the correlation between the measured width of silicon waveguides fabricated with 193 nm lithography and the local pattern density of the mask layout.
Bogaerts, Wim +3 more
core +1 more source
Micromachines, 2018 Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh +3 more
doaj +1 more source
An ART1 microchip and its use in multi-ART1 systems [PDF]
, 1997 Recently, a real-time clustering microchip neural engine based on the ART1 architecture has been reported. Such chip is able to cluster 100-b patterns into up to 18 categories at a speed of 1.8 μs per pattern.
Linares Barranco, Bernabé +1 more
core +1 more source
IMPLEMENTATION OF CONFIGURABLE RING OSCILLATOR PUF WITH SYMMETRICAL PATHS ON FPGA
Безопасность информационных технологийThis paper proposes a novel Physical Unclonable Function (PUF) scheme based on a configurable ring oscillator. The circuit utilizes the measurement of signal propagation delay differences along symmetric paths constructed using the internal resources of ...
Alexander A. Ivaniuk, Ksena I. Trubach
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A 77-GHz Six-Port Sensor for Accurate Near-Field Displacement and Doppler Measurements
Sensors, 2018 A continuous-wave (CW) radar sensor design based on a millimetre-wave six-port interferometer is proposed. A complete sensor prototype is conceived of, fabricated and measured at 77 GHz for short-range professional and industrial applications.
Homa Arab +4 more
doaj +1 more source